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2D Axisymmetric and 3D Heat Conduction Analysis Simulator using Finite Element Method ■□■Features■□■ ■ Since it is an integrated pre-post tool dedicated to the PHOTO series, data creation, analysis, and result processing can be performed as a series of operations. ■ It is integrated with other PHOTO series modules, allowing for easy coupled analysis, such as obtaining temperature distribution from heat generation calculated by electromagnetic field analysis. ■ It uses the ICCG method, making calculations fast and enabling analysis on a personal computer. ■ Since it employs the finite element method, the solutions are stable, making it user-friendly even for beginners. ■ Coupled calculations with stress analysis and fluid analysis are easy to perform.

We will introduce an analysis case that focuses on the boundary conditions used in thermal conduction analysis and compares the theoretical solution with simulation results. The thermal conduction analysis software "PHOTO-THERMO" can be used not only for coupled analysis using heat generation density obtained from electromagnetic field analysis but also as a standalone tool. In this case, we used a circular pipe model as shown in the left figure. We conducted thermal conduction analysis under three conditions: "constant temperature boundary condition," "heat generation density," and "heat transfer boundary condition." Since theoretical solutions can be obtained for all of these, you can evaluate the validity of the program by comparing the analysis results. 【Case Overview】 ■ Conditions for Thermal Conduction Analysis - Constant temperature boundary condition - Heat generation density - Heat transfer boundary condition *For more details, please refer to the related links or feel free to contact us.

In the PHOTO series, you can set the current density for models such as coils and perform coupled analysis with finite element models (such as magnetic materials) that are influenced by it, using it as an external field model.

The "PHOTO series" offers analysis solvers that utilize the most suitable simulation methods for a wide range of target fields, from high-frequency electromagnetic waves to low-frequency electric and magnetic fields, based on the analysis theme. Unlike other commercial software packages that handle all phenomena with a single analysis solver, we use the most appropriate analysis solver for the purpose, ensuring high analysis accuracy and detailed responsiveness to needs. Additionally, you can select only the necessary modules suited to the problem, which helps keep the implementation costs economical. It is also easy to expand functionality by adding modules, and by combining them, it is possible to handle coupled analyses such as heat generation due to eddy currents and stresses or deformations caused by electromagnetic forces. All products are compatible with three-dimensional problems, and the transient response analysis module can handle nonlinear materials.