一般財団法人材料科学技術振興財団　MST Product Lineup

UPS is a method that measures the kinetic energy distribution of electrons emitted by ultraviolet light irradiation, providing insights into the valence states of the sample's surface (on the order of a few nanometers). On the other hand, it is also used to evaluate the work function of various metal materials by utilizing high energy resolution. Since it can be measured alongside XPS analysis, it is possible to investigate the qualitative and quantitative surface composition of the sample and the correlation between bonding states and work function values.

- It is possible to evaluate the local structure (interatomic distances, coordination numbers) and chemical state (valence, coordination structure) around the target elements in the sample. - Measurements can be conducted regardless of the environment (high temperature, high pressure, atmosphere). - Measurements can be performed on various sample forms (solid, liquid, gas, thin films, amorphous materials, etc.). - A wide applicable concentration range (from major component elements to trace elements). - Non-destructive measurement. - Depending on the measurement method, it is possible to conduct measurements that are sensitive to the surface as well as bulk measurements.

XPS is a technique that measures the kinetic energy distribution of photoelectrons emitted by X-ray irradiation, providing insights into the types, quantities, and chemical bonding states of elements present on the sample surface (to a depth of about a few nanometers). Because it can provide information about chemical bonding states, it is also known as ESCA: Electron Spectroscopy for Chemical Analysis. - Qualitative and quantitative analysis of elements on solid surfaces (approximately 2 to 8 nm) is possible. - Chemical bonding state analysis is possible. - Non-destructive analysis is possible. - Measurement of depth distribution (using ion sputtering) is possible. - Measurement of insulators is possible. - Measurement under controlled atmospheres is possible.

From the analysis of the Cu2p3/2 spectrum and Cu Auger spectrum, it is possible to evaluate the bonding state, quantitative assessment, and film thickness of the Cu surface. Major application examples include the evaluation of CMP processing and cleaning of Cu wiring, as well as the investigation of rust and discoloration of Cu electrodes. We will summarize the surface states of Cu treated with various processes and the thickness of the oxide film. (Measurements can be conducted immediately after treatment in a clean room environment.)

In HAXPES, it is possible to obtain information from deep positions (up to about 50 nm) from the sample surface. Furthermore, by using a two-dimensional detector for angle-resolved measurements, data obtained at a wide range of photoelectron emission angles can be divided into information corresponding to different angles, that is, varying detection depths. This allows for a comparison of depth-resolved bonding states to greater depths than XPS in a non-destructive manner. It is effective for evaluating materials where state changes extend not only to the surface but also into the bulk.

Antimicrobial coatings and coated everyday items aimed at infection prevention, mold prevention, and odor control have become widely popular. Among them, silver ions (Ag) are known to exhibit antibacterial and sterilizing effects against bacteria and viruses, while being almost harmless to the human body, making them widely used as inorganic antimicrobial agents. We will introduce a case study that focused on the presence of Ag as an antimicrobial component on the sample surface and evaluated the presence and durability of the antimicrobial coating film.

In HAXPES, hard X-rays (Ga radiation) are used for excitation, which results in different positions of the Auger peaks compared to the Al and Mg radiation typically used in standard XPS measurements. Therefore, even in samples where the photoelectron peaks and Auger peaks overlap in Al and Mg measurements, this overlap can be avoided in Ga measurements, allowing for a detailed evaluation of the bonding states. This document presents the spectra of Kovar (an alloy of Fe, Ni, and Co) and GaN measured using Ga radiation (equipped with HAXPES) and Al and Mg radiation (equipped with XPS).

Next-generation all-solid-state batteries, which are lithium-ion batteries, are expected to have high safety, high energy density, high output, and a wide operating temperature range. In recent years, research and development aimed at practical application has been actively conducted, but there are various development challenges. At MST, we propose evaluation content suitable for solving development challenges based on comprehensive analysis and evaluation of structure, composition, and electrical properties. This document introduces specific examples of development challenges for all-solid-state batteries, their evaluation content, and representative evaluation methods for each component.

We have launched a new service using XPS/HAXPES starting in June! For increasingly complex materials and fine structure samples, we can evaluate the composition and chemical bonding states from the surface to the interior of the material (up to ~30nm) at the same location and in a non-destructive manner. - Depending on the elements of interest and the analysis area and depth, we can select the appropriate X-ray source (Al Kα/Mg Kα/Ga Kα/Cr Kα) to achieve evaluation under suitable measurement conditions. - Non-exposure measurements to the atmosphere, Ar monomer/GCIB sputter etching, and heating pretreatment can be combined. - It is possible to evaluate the electronic states of semiconductor samples using UPS/LEIPS (ionization potential/electron affinity/band gap).

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■ A consistent system that accompanies you until resolution and diverse analytical approaches We provide consistent support from hearing about the issues to reporting, collaboratively leading to optimal solutions through dialogue. With over 100 types of analytical methods and AI analysis, we cover challenges across all domains, responding to the trust that "MST is reliable" with flexible responses and proven results. ■ Abundant technical skills and experience We cater to a wide range of needs, from advanced analysis in existing fields like semiconductors to custom analysis in new areas. We have achievements in unique technologies such as the first domestic commercialization of FIB-TEM and SSDP-SIMS. ■ Fairness and reliability Since 1984, during the era when semiconductors took the world by storm, we have walked alongside the forefront of manufacturing. We maintain a fair and neutral stance, building solid trust through quality management based on ISO 9001. ■ Optimal problem-solving through AI analysis We propose solutions tailored to objectives and challenges through equipment analysis, AI analysis, and simulation. By maximizing the use of customer-owned data and designing and constructing custom AI models, we aim to generate results that meet specific needs. For inquiries regarding analysis and consultation, please feel free to contact us.