神港精機 Product Lineup

By melting solder in a vacuum, voids within the solder are eliminated. Additionally, by preheating in a hydrogen atmosphere or formic acid atmosphere, flux-free soldering is achieved. We take pride in being the number one in domestic achievements as a standard machine in the power device manufacturing process. With a wide range of options and a rich lineup of equipment, we propose the optimal device for our customers. <Recipient of the Excellence Award at the 2nd Monozukuri Japan Awards>

Application of the basic configuration of a vacuum soldering device with a proven track record. High-speed heat treatment using a heated plate for soldering. Degassing and drying of high-density mounting substrates and printed boards before film formation. Ideal for various applications such as drying ceramic materials. Effective for low-temperature baking of solar cell cells and annealing of thin films, also compatible with inline processes.

A dedicated annealing device designed for special applications such as epitaxial layers of compound semiconductors and the annealing of polished Si wafers. After high vacuum evacuation, the atmosphere is replaced with hydrogen up to atmospheric pressure, allowing for uniform heating at high temperatures (1000°C) in a high-purity reducing atmosphere.

Replacement of the atmosphere in the furnace with hydrogen reduction. Achieving low oxygen concentration and reduction atmosphere treatment that cannot be realized with an inert atmosphere using N2 through continuous processing in a conveyor furnace. Utilizing the reduction effect of the hydrogen atmosphere, it supports high-temperature soldering and continuous reduction atmosphere heat treatment that require high reliability, which cannot be addressed by conventional reflow. There is also a wealth of experience in firing various pastes. The system covers the reflow process for wafer bumps of system LSI with a CtC type compatible with 300 mm wafers. In addition to conventional soldering, brazing, and paste firing processes, it also has a proven track record in sintering bonding for next-generation bonding materials (metal nano-paste). A demonstration machine is permanently available to reliably support initial tests for various applications through to mass production.

The vacuum soldering device removes voids in the solder by melting the solder in a vacuum. By performing preheating in a hydrogen atmosphere or formic acid atmosphere, it achieves flux-free soldering. It boasts the number one domestic track record as a standard machine in the power device manufacturing process. With the adoption of an upper lamp heater specification, it can accommodate large products and irregular substrates, including heavy items. [Exhibition Information] We will exhibit at Internepcon 2023. A panel of this device and samples of large products will be displayed. (Exhibition dates: January 25 (Wed) to January 27 (Fri) at Tokyo Big Sight, Booth Number: East Hall 1, 2-34) *For detailed specifications, please download the PDF. Feel free to contact us.

A large substrate-compatible model has been introduced for our vacuum reflow device, which boasts the industry's No. 1 track record! It can be utilized not only for conventional soldering but also for sintering bonding, via firing, and other multipurpose processing. For sintered material compatibility, gas introduction is possible without initial vacuum evacuation. It supports sizes up to 615×615mm while achieving the same temperature distribution performance within the substrate as previous models. We also accommodate various customizations. Please feel free to contact us.