A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.
Application of the basic configuration of a vacuum soldering device with a proven track record. High-speed heat treatment using a heated plate for soldering. Degassing and drying of high-density mounting substrates and printed boards before film formation. Ideal for various applications such as drying ceramic materials. Effective for low-temperature baking of solar cell cells and annealing of thin films, also compatible with inline processes.
Inquire About This Product
basic information
Supports processing of 300mm square substrates with a rapid heating hot plate. Achieves short time and short cycle processing through a substrate cooling mechanism. Provides a stable heating process for substrates that are prone to damage from prolonged heating. System upgrade to inline type is easy based on evaluations of the standard batch type.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
Multilayer printed circuit board baking Small FPD substrate annealing Thin-film solar cell annealing and baking Ceramic fiber drying
catalog（4）
Download All Catalogs
Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
![Single End Radiant Tube Burner [TRF Burner]](https://image.mono.ipros.com/public/product/image/c08/2000793597/IPROS40624651388633756578.png?w=280&h=280)