三明 List of Products and Services

The "BA100/160/200" is a manual double-sided mask aligner that achieves high positional accuracy patterning on both the top and bottom sides. In addition to the desktop models "BA100" for 4-inch wafers and "BA160" for 6-inch wafers, there is also a standalone model "BA200" for 8-inch wafers. Furthermore, the alignment accuracy is ±2μm on the top side and ±5μm on the bottom side. 【Specifications (excerpt)】 ■ Wafer size: 4in/6in/8in ■ Exposure light source intensity distribution: within ±5% ■ Exposure resolution ・Soft contact: L/S 3μm ・Hard contact: L/S 1μm *For more details, please refer to the PDF document or feel free to contact us.

The "Spray Coater" can handle liquid chemicals from low to high viscosity and can be applied to fine uneven surfaces. Thanks to the spray nozzle capable of fine particle generation, it can form a uniform film on inclined surfaces, cavities, trench structures, and other areas that are difficult to coat with conventional spinners. It is also suitable for applications that require uniform spraying of liquid chemicals, such as anti-reflective coatings, onto glass materials. 【Features】 ■ Capable of coating fine uneven surfaces ■ Compatible with liquid chemicals from low to high viscosity ■ Supports film thickness from a few micrometers to several hundred micrometers ■ Suitable for three-dimensional resist coating and MEMS devices *For more details, please refer to the PDF document or feel free to contact us.

The "Murabiyuwa Series" changes the common sense of inspection. It is a new sensation scope that allows you to confirm "invisible and hard-to-see" defects in a "clear and vivid" manner. It enables visual inspection and evaluation of nano-sized fine polishing marks, orange peel, scratches remaining on the surfaces of glass, crystal, sapphire, and fine grain patterns and crystal defects inside, leading to improved management of surface roughness, setting of polishing conditions, and significantly enhancing yield after deposition.

We would like to introduce our "PEC Process Equipment." You can choose the light source and wavelength from UVA and UVC, enabling high-speed deep etching through the heating of the etching solution. Etching rinse parameters can be set via a touch panel input. Please feel free to contact us when you need assistance. 【Features】 ■ From 10mm square small chips to φ6 inch wafers ■ Capable of low-damage etching for GaN ■ Achieves low cost with a simple structure ■ Enables high-speed deep etching *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "UV Nanoimprint Stepper." It uses a roll transfer method with large resin molds, allowing for simultaneous full-area transfer. Additionally, we offer a heating mechanism as an optional extra, with high-precision transfer pressure control. 【Features】 ■ Compatible with 2 to 8-inch wafers ■ High-precision alignment necessary for device fabrication ■ High-precision transfer pressure control ■ Optional heating mechanism *For more details, please refer to the PDF document or feel free to contact us.

The "SIM 3000" is a base model of a customizable inspection device that can be tailored to meet various customer requirements. It automatically detects foreign objects, defects, scratches, and unevenness at a size of 1μm. Equipped with both micro and macro inspection units, it can accommodate various inspections and, with its multifunctionality, allows for inspection reviews and verification of processing areas, enabling the construction of a system tailored to the customer's objectives. 【Features】 ■ Supports large workpieces such as 300mm x 300mm ■ Automatically detects foreign objects, defects, scratches, and unevenness at a size of 1μm ■ Capable of generating highly accurate mapping data and defect lists ■ Various functions can be customized according to customer requests ■ Equipped with micro and macro inspection units *For more details, please refer to the PDF document or feel free to contact us.

The "SIM-2300EG" is a wafer edge viewer equipped with recording functionality. In today's processes where wafer thinness is required, it allows for monitoring of the wafer edge conditions, such as "chipping" and "cracking" during back grinding, as well as "foreign material adhesion" and "misalignment" during bonding. It features a high-precision mechanical wafer size changer and alignment function, enabling continuous recording of the top and bottom surfaces and sides of the edge, as well as dimension measurement and binary display. 【Features】 ■ Supports wafer sizes from 4 inches to 12 inches ■ Equipped with a high-precision mechanical wafer size changer and alignment function ■ Compatible with various wafers including bonding, back grinding, and trimming ■ Enables continuous recording of the top and bottom surfaces and sides of the edge, as well as dimension measurement and binary display *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our mass production process exposure equipment, the "Fully Automatic Mask Aligner." It achieves a simple structure at a low cost. It has high versatility compatible with circular and square samples. We offer the "ALA410" for 4-inch size and the "ALA810" for 8-inch size. 【Features】 ■ High versatility (compatible with circular and square samples) ■ Reliable spherical bearing parallel mechanism ■ Achieves low cost with a simple structure ■ Available in Φ4in, Φ6in, and Φ8in specifications ■ CToC automatic transport *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the "Semi-Automatic Mask Aligner" handled by Sanmei Corporation. This product is a semi-automatic exposure device for mass production of various types, with an exposure light source that maintains an illumination distribution within ±5%. It can perform automatic gap adjustment, manual alignment, automatic contact exposure, and automatic transport in a streamlined process. Please feel free to contact us for more details. 【Specifications】 ■ φ4in φ6in φ8in specifications ■ Top-side alignment ■ Bottom-side alignment *For more details, please refer to the PDF document or feel free to contact us.