アイビット List of Products and Services

The IX-1610 is an X-ray observation device equipped with defect analysis capabilities, featuring world-class X-ray resolution. By adopting an X-ray tube with the world's smallest focal spot size of 0.25μm, it achieves high resolution. With six-axis control, it enables high-function observation and automatic inspection. 【Features】 ■ Uses a 160kV, 0.2mA, 0.25μm open-type micro-focus X-ray tube ■ X-ray geometric magnification: 1,200 times ■ Employs a transmission-type target ■ Uses a 2.8 million pixel X-ray digital I.I. tube ■ Employs a transmission-type target *For more details, please refer to the catalog or feel free to contact us.

It's dangerous to trust only the catalog! Did you know that in actual devices, large > small, high > low, and bright > dark can be reversed when only comparing numerical values? Some companies may not be aware that they are not obtaining images with the resolution they imagined from the X-ray equipment they are currently using. This document thoroughly explains the necessary points for appropriate equipment selection from various perspectives! We provide all the comparative data of two products with different tube currents using the JIMA test chart. ★ You can view the table of contents from the "PDF Download." If you would like the complete version, please apply through "Contact Us." [Content (excerpt)] ■ Differences between catalog specifications and actual image resolution ■ How X-rays are generated ■ Differences between geometric magnification and monitor magnification ■ The impact of X-rays on semiconductor components * Additionally, we offer verification using actual devices that clearly shows the differences in resolution. About 80% of the companies that conducted the tests have made purchases! If you're interested, please feel free to contact us.

Our company has been involved in the development, clarification, and release of various devices. For example, we developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers and clarified the mechanism of vacuum soldering. We also have a history of receiving awards for technological development and being recognized as an excellent company. [Career Highlights (Excerpt)] ■2003: Introduced "Hydrogen/Vacuum/Heating Furnace" into X-ray equipment Clarified the mechanism of vacuum soldering ■2004: Developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers ■2005: Merged X-ray equipment with die bonders, integrating chip mounting functions ■2006: Developed a fully automated inspection machine for crystal defect voids in Si wafers *For more details, please refer to the PDF document or feel free to contact us.

The product has the capability to separately inspect the solder under the chip and the solder under the insulating substrate using the "X-ray stereo method." When using the X-ray transmission principle in the X-ray stereo method, the solder joint under the chip and the solder joint under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray capable of penetrating a 5mm copper plate with 130kV, 0.5mA, and 39W (FX-500tRX) ■ Achieves high resolution with high output of 110kV, 0.2mA, 20W and spatial resolution of 2μm (FX-400tRX) ■ Enables two-layer separation inspection using 3D X-ray stereo method ■ Reduction in running costs due to the adoption of a long-life, 1.3 million pixel, 14-bit (16384 gradation) X-ray flat panel ■ Compact inspection machine body with traceability support through QR code recognition *For more details, please refer to the PDF document or feel free to contact us.

This product is a three-dimensional X-ray observation device compatible with large substrates. It allows real-time X-ray observation by penetrating X-rays through the invisible parts of the inspection target. It is suitable for observing large printed circuit boards and large mounted substrates. It covers the entire area of a substrate size of 600×600mm and achieves a geometric magnification of 1,000 times. With the X-ray stereo method, it is possible to observe by removing the mounted components on the back side. 【Features】 - Covers the entire area of a substrate size of 600×600mm - Achieves a geometric magnification of 1,000 times - The X-ray camera can be tilted to any angle from 0 to 60° - Improved operability with a touch panel and joystick - Large samples can be easily set with a sliding door - The turntable can accommodate substrates up to 400×400mm (optional) *For more details, please refer to the PDF document or feel free to contact us.

In conventional X-ray inspections, the chip components on the backside became noise components, making accurate inspections difficult. By using the "X-ray stereo method" developed by I-BIT, it has become possible to cancel out chip components mounted on the backside, such as BGA, LGA, and QFN. In this product, unlike conventional X-ray CT methods, it does not require tomographic images, allowing for high-speed processing. 【Features】 ■ Adoption of X-ray stereo method (our proprietary technology) ■ Achieved geometric magnification of 1,000 times ■ Equipped with chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ Measurement of solder rise (solder filling rate) in through-holes is possible *New feature ■ Automatic BGA inspection function (optional) ■ VCT (Vertical CT) and PCT (Oblique CT) functions (optional) *For more details, please refer to the PDF document or feel free to contact us.

This product is an X-ray inspection device newly equipped with a chip counter function. The chip counter function counts the number of electronic components within embossed tape wound on a reel by using X-ray transmission images. The tape reel can be set in the device as it is, and by pressing the count button, the quantity of "components in the reel" is counted in about 30 seconds. The counted quantity is linked to a barcode and output as a CSV file. 【Features】 ■ Can accommodate tape reels with a diameter of up to 250mm ■ Chip counting possible in about 30 seconds per reel ■ Barcode compatible, CSV output compatible (BC reader not included) ■ Capable of counting chips of size C0402 *For more details, please refer to the PDF document or feel free to contact us.

This product is a cost-effective X-ray observation device that achieves a geometric magnification of 900 times while being compact. You can register good quality images and compare them with current images, and it is possible to observe with the flat panel tilted at 60°. Target to sample distance is 0.5mm, target to X-ray camera distance is 450mm: 450/0.5=900. The L-size device is compatible with substrates of 600×600mm. 【Features】 ■ Equipped with various measurement functions ■ Ability to register good quality images and compare them with current images ■ Flat panel can be tilted at 60° for observation ■ Automatic tracking of observation position for diagonal observation (points do not shift even if the camera is tilted) ■ Inspection functions can be added as an option ■ CT function and L-size compatibility can be added as options *For more details, please refer to the PDF document or feel free to contact us.

The "FX-300tR2" is an X-ray observation device that allows for the comparison and observation of current images against registered good quality images. Despite being a compact and small X-ray device, it achieves a geometric magnification of 900 times. The flat panel can be tilted at 60° for observation, and it automatically follows the observation position for diagonal viewing. It achieves a real resolution of 5μm, and the L-size device can accommodate substrates of 600×600. 【Features】 ■ Geometric magnification: 900 times ■ Monitor magnification: 5,400 times ■ X-ray output: 90kV ■ X-ray focal diameter: 5μ, 15μ (switchable) *For more details, please refer to the PDF document or feel free to contact us.

The "FX-300 tRX2/LL with CT" is a three-dimensional X-ray observation device that employs X-ray stereo technology. It is capable of canceling chip components mounted on the underside of BGA, LGA, QFN, etc. Additionally, a convenient chip counter function (capable of counting quantities in reel state) is now standard. 【Features】 ■ Adopts X-ray stereo technology (unique technology by Ibit) ■ Achieves a geometric magnification of 1,000 times ■ Equipped with a chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ An LL model compatible with large substrates of 600×600mm is also available *For more details, please refer to the PDF document or feel free to contact us.

Aibit has opened a demonstration room called "MUSUBI Osaka Labo" in Shin-Osaka, where equipment from seven companies related to semiconductor manufacturing is gathered. It is also possible to validate and experiment with substrates using our X-ray inspection equipment, and you can experience how our unique "X-ray stereo method" resolves the difficulty of inspecting substrates that overlap and are hard to see in just 4 seconds. 【Demonstration Room Overview】 Location: 1-7-27 Nishinomiya-hara, Yodogawa-ku, Osaka City, Osaka Prefecture Business Hours: Weekdays 9:00 AM to 5:00 PM (About a 10-minute walk from JR Shin-Osaka Station) *For more details, please refer to the materials. Feel free to contact us as well.

The "FX-400tRX/LL" is an X-ray observation device that enables the acquisition of clear X-ray images with a high resolution of 2μm and a geometric magnification of 500 times. It can inspect the connection points of IC wire bonding and copper wires, as well as observe through-holes inside printed circuit boards. Additionally, with a high output of 110kV and 200μA, it is now possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution image acquisition of fine details with a resolution of 2μm ■ High magnification imaging with a geometric magnification of 500 times ■ X-ray stereo method allows separation of the surface and back side of the mounted board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 300 horizontal cross-sections of the mounted board (approximately 50 seconds) *For more details, please refer to the PDF document or feel free to contact us.

The "FX-500tRX" is an X-ray observation device that uses the "X-ray stereo CT method" to individually inspect the solder joints under the bus bar, under the power chip, and under the insulating substrate of power devices. When using the conventional principle of X-ray transmission, the solder joints under the chip and under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray source of 130kV and 300uA capable of penetrating 5mm copper plates ■ Ultra-long life 1.3 million pixel X-ray flat panel significantly reduces running costs ■ Separation of the front and back surfaces of the mounted board using the X-ray stereo method (approximately 4 seconds) ■ Acquisition of 300 layers of horizontal cross-sections of the mounted board using the X-ray stereo CT method (approximately 50 seconds) ■ Automatic inspection using CT functionality (OK/NG judgment) *For more details, please refer to the PDF document or feel free to contact us.

The "FX-300 tRX2 with CT" is a three-dimensional X-ray observation device that can inspect the chip components on the underside of a circuit board by canceling them out using its unique "X-ray stereo method." It also comes standard with a chip counter function, allowing it to count the quantity of electronic components such as square chips, ICs, and LEDs in reel form in approximately 20 to 30 seconds. This product supports dual functions for "inspection of BGA, LGA, QFN, etc." and "counting the number of chip components" at a reasonable price. 【Features】 ■ Geometric magnification of 1,000 times ■ Compact sealed tube type ■ Capable of diagonal shooting at high magnification ■ The LL model supports large circuit boards of 600×600mm ■ Optional features such as automatic BGA inspection, vertical CT, and diagonal CT can also be added *For more details, please refer to the PDF document or feel free to contact us.

We will be exhibiting our 【X-ray inspection equipment】 at the "MUSUBI Okayama Exhibition" to be held from November 21 (Tuesday) to November 22 (Wednesday). ■ Equipment exhibited by Aibit: Offline X-ray Inspection System: FX-400tRX - Surface and back surface cancellation of the mounted circuit board using X-ray stereo method (approximately 4-5 seconds) - Acquisition of 300 layers of horizontal cross-section of the mounted circuit board using X-ray stereo CT method - High-output X-ray source with 110kV, 200µA - Acquisition of fine images with a high resolution of 2μm - Automatic inspection using CT function (OK/NG judgment) In addition to the equipment being exhibited this time, we have various other devices tailored to customer applications. Please feel free to contact us. 【Demonstration on the day】 Sample imaging can be performed using your samples. Please contact us in advance with your preferred date and time, as well as sample details. If you wish to have a demonstration at the venue, please let us know. *Please note that if there is no prior contact, it may not be possible to conduct imaging on the day according to the schedule. 【Exhibition Overview】 Period: November 21 (Tuesday) to November 22 (Wednesday) Venue: Okayama "Convex Okayama Small Exhibition Hall" For more details, please contact us.

We would like to introduce our high-magnification X-ray observation device, the 'FX-300tR2', along with its reel observation function. This product is a device that inspects electronic components and semiconductor components on a reel, one by one as they are unwound. With a single X-ray device, it is now possible to conduct inspections both by arranging ICs on a conventional inspection table and by unwinding the reel. Please feel free to contact us if you have any inquiries. 【Features】 ■ Geometric magnification: 900x ■ Monitor magnification: 5,400x ■ X-ray output: 90kV ■ X-ray focal diameter: 5μ, 15μ (switchable) *For more details, please refer to the PDF document or feel free to contact us.

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting process manufacturers, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, analysis methods for defects using X-rays, and ways to identify the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in board through-holes." We look forward to your attendance. 【Event Overview】 ■ Date and Time - November 28, 2024 (Thursday) 15:00 - 16:00 - November 29, 2024 (Friday) 10:15 - 11:15 ■ Venue: Gran Messe Kumamoto Conference Room ■ Address: 1010 Fukutomi, Mashiki Town, Kamimashiki District, Kumamoto Prefecture ■ Participation Fee: Free *For more details, please download the PDF or feel free to contact us.

The "FX-500tRX2-LL" is an X-ray stereo method 3D X-ray observation device that supports large substrates of 700×600mm. With its unique "X-ray stereo method," it cancels the backside of mounted substrates. The further evolved "X-ray stereo CT method" allows for slicing the mounted substrate into 500 layers. For 600×600mm substrates, there are no restrictions on the CT imaging area with "anywhere CT." The X-ray output/X-ray resolution is 130kV, 300μA, 39W/4μm. 【Features】 ■ 2D transmission, diagonal 60-degree observation: 700×600mm ■ 3D X-ray stereo CT observation: 600×600mm ■ Geometric magnification: minimum 1.4x to maximum 2000x ■ 3D X-ray V-CT compatible (vertical CT) ■ 3D X-ray P-CT compatible (diagonal CT) ■ Through-hole solder filling rate measurement *For more details, please download the PDF or feel free to contact us.

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition" held at Haibu Nagaoka (Niigata). At this exhibition, you will be able to see new equipment from various manufacturers that continue to support quality improvement and productivity enhancement in production sites. We plan to showcase a 3D X-ray observation device, a 3D X-ray stereo method observation device, and a 3D X-ray stereo method inline X-ray inspection device. 【Event Overview】 ■ Date: April 24 (Thursday) to April 25 (Friday), 2025 ■ Time: 10:00 AM to 5:00 PM (Last admission at 4:00 PM) ■ Admission Fee: Free ■ Venue: Haibu Nagaoka, 1st Floor Full Hall *For more details, please download the PDF or feel free to contact us.