アイビット List of Products and Services

The "Six-3000" is an X-ray automatic inspection device that automatically inspects and judges bumps on wafers. It uses X-rays to penetrate voids (bubbles) inside the wafer, and from the transmitted images, it calculates the diameter (area) of the voids and automatically inspects whether the voids exceed the reference value. A micro-focus X-ray tube is used as the X-ray source, and a high-performance X-ray digital camera is employed for the X-ray imaging section, enabling the extraction of high-resolution images and allowing for high-precision void inspection. 【Features】 ■ High-resolution images can be extracted ■ High-precision void inspection is possible ■ High-speed inspection and inspection of small wafer bumps are possible *For more details, please refer to the catalog or feel free to contact us.

The "X-CAS-2" from iBit is a device that automatically inspects voids, which are crystal defects inside silicon wafers, using X-rays. By adopting an X-ray inspection method, it is possible to conduct inspections regardless of the wafer's resistance value and even in the state before polishing (immediately after slicing). The sizes of the silicon wafers to be inspected are 12 inches and 8 inches, with an option to add 6 inches. 【Features】 - Automatically inspects voids inside silicon wafers - Inspections can be performed regardless of the wafer's resistance value - Inspections can be conducted even in the state before polishing - Inspections are applicable for 12-inch, 8-inch, and optionally 6-inch silicon wafers *For more details, please refer to the catalog or feel free to contact us.

The "ILX-1000/2000" is an inline X-ray inspection device that automatically inspects the soldering areas of mounted circuit boards. Thanks to our unique inspection method, it supports separate inspections of the front and back surfaces of the circuit board. It is not affected by the back side of double-sided mounted boards. Additionally, 3D tomography inspection is also possible. It is suitable for inspecting soldering areas of BGA/CSP components and components like QFN/SON that have soldering on the bottom surface. 【Features】 ■ Capable of inspecting bottom-soldered components such as BGA ■ Can cancel out components on the back side of the board for inspection ■ Supports small boards (50×50mm) to large sizes (510×460mm) ■ Compact and space-saving, suitable for inline use *We are currently offering detailed materials that explain the product. Please refer to those for more information.

It's dangerous to trust only the catalog! Did you know that in actual devices, large > small, high > low, and bright > dark can be reversed when only comparing numerical values? Some companies may not be aware that they are not obtaining images with the resolution they imagined from the X-ray equipment they are currently using. This document thoroughly explains the necessary points for appropriate equipment selection from various perspectives! We provide all the comparative data of two products with different tube currents using the JIMA test chart. ★ You can view the table of contents from the "PDF Download." If you would like the complete version, please apply through "Contact Us." [Content (excerpt)] ■ Differences between catalog specifications and actual image resolution ■ How X-rays are generated ■ Differences between geometric magnification and monitor magnification ■ The impact of X-rays on semiconductor components * Additionally, we offer verification using actual devices that clearly shows the differences in resolution. About 80% of the companies that conducted the tests have made purchases! If you're interested, please feel free to contact us.

The "Six-3000" is an automatic X-ray inspection device that inspects and determines bumps on wafers. It uses X-rays to penetrate voids inside the wafer and calculates the diameter (area) of the voids from the transmitted images, automatically determining the quality of voids exceeding the reference value. A micro-focus X-ray tube is used as the X-ray source, and an X-ray digital camera is employed for the X-ray detection part, allowing for the extraction of high-resolution images. This enables high-precision void inspection. Additionally, we also offer the silicon wafer crystal defect void inspection device "X-CAS-2." 【Features of Six-3000】 ■ An automatic X-ray inspection device that inspects and determines bumps on wafers ■ Uses X-rays to penetrate voids (bubbles) inside the wafer ■ Automatically determines the quality of voids exceeding the reference value ■ Uses a micro-focus X-ray tube as the X-ray source ■ Employs an X-ray digital camera for the detection part, extracting high-resolution images *For more details, please refer to the PDF materials or feel free to contact us.

The IC wire bonding X-ray inspection device "LFX-1000R" is a device that uses X-rays to perform radiographic inspection of the internal condition of reel-type IC components. While winding the ICs from the tape reel, it automatically inspects the connection status of the wire bonding for each individual IC (Good/NG judgment). The compatible reel dimensions range from 180 to 380 mm. 【Features】 ■ Compatible reel dimensions: 180 to 380 mm ■ Radiographic inspection of the internal condition of IC components using X-rays ■ Automatic inspection of the connection status of wire bonding for each individual IC ■ A lead frame compatible type "LFX-1000" is also available *For more details, please refer to the PDF document or feel free to contact us.

This product is an inline X-ray inspection device capable of fully automated inspection, which inspects the condition of wire bonds and lead frames inside ICs with high speed and high precision. It automatically conveys and inspects the lead frame condition, marking any defective areas. In addition to inspecting wire bonds, it can also inspect for metal foreign objects and lead frame pitch. It can be connected to various types of loaders and unloaders. 【Features】 - Automatic conveyance and inspection in the lead frame condition - Capable of inspecting for metal foreign objects and lead frame pitch - Can be connected to various types of loaders and unloaders - Lead frames can be set directly onto the loader or supplied via a magazine rack *For more details, please refer to the PDF document or feel free to contact us.

This product is an analytical X-ray observation device with a high resolution of 0.25μm X-ray focal size. It uses a 160kV, 0.2mA, open-type micro-focus X-ray tube and a transmission-type target. With 6-axis control, it enables high-function observation and automatic inspection. 【Features】 ■ 160kV, 0.2mA, open-type ■ Uses a micro-focus X-ray tube ■ One of the smallest X-ray focal sizes in the world (0.25μm) ■ X-ray magnification: 2,000 times ■ Uses a transmission-type target ■ Equipped with a 2.8 million pixel X-ray digital I.I. tube *For more details, please refer to the PDF document or feel free to contact us.

This product is an inline inspection device that automatically inspects the solder joints of mounted circuit boards using X-rays. In high-density circuit boards, the solder joints are located on the bottom surface of the components (face down), making visual inspection impossible. It is suitable for inspecting components like QFN/SON, where the solder joints are on the bottom surface of the components. 【Features】 - Safe design, no qualifications required for handling X-rays - Compact and space-saving, enabling inline X-ray inspection - Can inspect without being affected by the backside of double-sided mounted circuit boards - Capable of 3D tomographic inspection using X-ray stereo method - Supports small circuit boards (50×50mm) to large sizes (510×460mm) - Capable of inspecting bottom-soldered components like BGA using X-ray stereo method *For more details, please refer to the PDF materials or feel free to contact us.

Our company has been involved in the development, clarification, and release of various devices. For example, we developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers and clarified the mechanism of vacuum soldering. We also have a history of receiving awards for technological development and being recognized as an excellent company. [Career Highlights (Excerpt)] ■2003: Introduced "Hydrogen/Vacuum/Heating Furnace" into X-ray equipment Clarified the mechanism of vacuum soldering ■2004: Developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers ■2005: Merged X-ray equipment with die bonders, integrating chip mounting functions ■2006: Developed a fully automated inspection machine for crystal defect voids in Si wafers *For more details, please refer to the PDF document or feel free to contact us.

This product is an X-ray inspection device that can slice a printed circuit board from the top surface to the bottom surface into 300 layers using X-ray stereo technology (our proprietary technology). The resolution has increased threefold from the conventional 100-layer cross-section to a 300-layer cross-section. The X-ray output is 110kV, 200μA, with a resolution of 2μm. It comes standard with a chip counter function and allows selection from three types of CT methods. 【Features】 ■ X-ray stereo technology (our proprietary technology) ■ Slices the printed circuit board from the top surface to the bottom surface into 300 layers ■ Resolution improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section ■ X-ray output of 110kV, 200μA, with a resolution of 2μm ■ Three types of CT methods (V-CT, diagonal CT, stereo CT) *For more details, please refer to the PDF document or feel free to contact us.

The product has the capability to separately inspect the solder under the chip and the solder under the insulating substrate using the "X-ray stereo method." When using the X-ray transmission principle in the X-ray stereo method, the solder joint under the chip and the solder joint under the insulating substrate appear in the same position, causing the front and back to overlap, which prevents accurate inspection. The X-ray stereo method is a groundbreaking inspection device that allows for the separation and individual inspection of each solder joint. 【Features】 ■ High-output X-ray capable of penetrating a 5mm copper plate with 130kV, 0.5mA, and 39W (FX-500tRX) ■ Achieves high resolution with high output of 110kV, 0.2mA, 20W and spatial resolution of 2μm (FX-400tRX) ■ Enables two-layer separation inspection using 3D X-ray stereo method ■ Reduction in running costs due to the adoption of a long-life, 1.3 million pixel, 14-bit (16384 gradation) X-ray flat panel ■ Compact inspection machine body with traceability support through QR code recognition *For more details, please refer to the PDF document or feel free to contact us.

Aibit has opened a demonstration room called "MUSUBI Osaka Labo" in Shin-Osaka, where equipment from seven companies related to semiconductor manufacturing is gathered. It is also possible to validate and experiment with substrates using our X-ray inspection equipment, and you can experience how our unique "X-ray stereo method" resolves the difficulty of inspecting substrates that overlap and are hard to see in just 4 seconds. 【Demonstration Room Overview】 Location: 1-7-27 Nishinomiya-hara, Yodogawa-ku, Osaka City, Osaka Prefecture Business Hours: Weekdays 9:00 AM to 5:00 PM (About a 10-minute walk from JR Shin-Osaka Station) *For more details, please refer to the materials. Feel free to contact us as well.

This product is a three-dimensional X-ray observation device compatible with large substrates. It allows real-time X-ray observation by penetrating X-rays through the invisible parts of the inspection target. It is suitable for observing large printed circuit boards and large mounted substrates. It covers the entire area of a substrate size of 600×600mm and achieves a geometric magnification of 1,000 times. With the X-ray stereo method, it is possible to observe by removing the mounted components on the back side. 【Features】 - Covers the entire area of a substrate size of 600×600mm - Achieves a geometric magnification of 1,000 times - The X-ray camera can be tilted to any angle from 0 to 60° - Improved operability with a touch panel and joystick - Large samples can be easily set with a sliding door - The turntable can accommodate substrates up to 400×400mm (optional) *For more details, please refer to the PDF document or feel free to contact us.

In conventional X-ray inspections, the chip components on the backside became noise components, making accurate inspections difficult. By using the "X-ray stereo method" developed by I-BIT, it has become possible to cancel out chip components mounted on the backside, such as BGA, LGA, and QFN. In this product, unlike conventional X-ray CT methods, it does not require tomographic images, allowing for high-speed processing. 【Features】 ■ Adoption of X-ray stereo method (our proprietary technology) ■ Achieved geometric magnification of 1,000 times ■ Equipped with chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ Measurement of solder rise (solder filling rate) in through-holes is possible *New feature ■ Automatic BGA inspection function (optional) ■ VCT (Vertical CT) and PCT (Oblique CT) functions (optional) *For more details, please refer to the PDF document or feel free to contact us.

This product is an X-ray inspection device newly equipped with a chip counter function. The chip counter function counts the number of electronic components within embossed tape wound on a reel by using X-ray transmission images. The tape reel can be set in the device as it is, and by pressing the count button, the quantity of "components in the reel" is counted in about 30 seconds. The counted quantity is linked to a barcode and output as a CSV file. 【Features】 ■ Can accommodate tape reels with a diameter of up to 250mm ■ Chip counting possible in about 30 seconds per reel ■ Barcode compatible, CSV output compatible (BC reader not included) ■ Capable of counting chips of size C0402 *For more details, please refer to the PDF document or feel free to contact us.

This product is a cost-effective X-ray observation device that achieves a geometric magnification of 900 times while being compact. You can register good quality images and compare them with current images, and it is possible to observe with the flat panel tilted at 60°. Target to sample distance is 0.5mm, target to X-ray camera distance is 450mm: 450/0.5=900. The L-size device is compatible with substrates of 600×600mm. 【Features】 ■ Equipped with various measurement functions ■ Ability to register good quality images and compare them with current images ■ Flat panel can be tilted at 60° for observation ■ Automatic tracking of observation position for diagonal observation (points do not shift even if the camera is tilted) ■ Inspection functions can be added as an option ■ CT function and L-size compatibility can be added as options *For more details, please refer to the PDF document or feel free to contact us.

The "LFX-1000" is an inline X-ray inspection device capable of fully automated inspection using a reflective type. It inspects the state of wire bonds and lead frames inside ICs with high speed and high precision. In addition, we also handle the transmission type "LFX-2000," as well as the reflective type automatic inspection device for reel-compatible IC wire bonds, "LFX-1000R," and the transmission type "LFX-2000R." 【Features】 ■ Automatically transports and inspects in the state of the lead frame, marking defective areas. ■ Capable of inspecting not only wire bonds but also metal foreign objects and lead frame pitch. ■ Lead frames can be set directly in the loader section or supplied via a magazine rack. *For more details, please refer to the PDF document or feel free to contact us.

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting process manufacturers, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, analysis methods for defects using X-rays, and ways to identify the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in board through-holes." We look forward to your attendance. 【Event Overview】 ■ Date and Time - November 28, 2024 (Thursday) 15:00 - 16:00 - November 29, 2024 (Friday) 10:15 - 11:15 ■ Venue: Gran Messe Kumamoto Conference Room ■ Address: 1010 Fukutomi, Mashiki Town, Kamimashiki District, Kumamoto Prefecture ■ Participation Fee: Free *For more details, please download the PDF or feel free to contact us.

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition" held at Haibu Nagaoka (Niigata). At this exhibition, you will be able to see new equipment from various manufacturers that continue to support quality improvement and productivity enhancement in production sites. We plan to showcase a 3D X-ray observation device, a 3D X-ray stereo method observation device, and a 3D X-ray stereo method inline X-ray inspection device. 【Event Overview】 ■ Date: April 24 (Thursday) to April 25 (Friday), 2025 ■ Time: 10:00 AM to 5:00 PM (Last admission at 4:00 PM) ■ Admission Fee: Free ■ Venue: Haibu Nagaoka, 1st Floor Full Hall *For more details, please download the PDF or feel free to contact us.

Aibit Inc. will be exhibiting at the "1st [Kansai] Nepcon Japan - Electronics Development and Implementation Exhibition" held at Intex Osaka. At this exhibition, cutting-edge electronic components, materials, and manufacturing, implementation, and inspection equipment that support the multifunctionality and high performance of electronic devices will be showcased. Manufacturers from various sectors such as electronics, semiconductors and sensors, electronic components, automotive and electrical equipment, and aerospace will attend for the introduction and comparative study of advanced technologies. Our company plans to exhibit inline X-ray inspection equipment and 3D X-ray inspection equipment. 【Event Overview】 ■ Dates: May 14 (Wed) - 16 (Fri), 2025 ■ Hours: 10:00 AM - 5:00 PM ■ Admission Fee: Free ■ Venue: Intex Osaka *For more details, please download the PDF or feel free to contact us.

The "FX-300tRR" is a high-magnification X-ray inspection device that allows for easy inspection of electronic components on reels. It retains the performance and functionality of the conventional model FX-300tR2 while offering "high magnification of 900x for 2D inspection, vertical 0° to diagonal 60°," "reel-to-reel inspection," and analysis with "3D-CT," making it a multifunctional product that serves three roles in one device. Additionally, by changing the tray, it can also perform solder inspection of mounted circuit boards and inspections using JEDEC standard trays. 【Features】 ■ Allows for photographic confirmation of individual components while still on the reel ■ Capable of inspecting 3,000 reel components in about one hour ■ Automatic operation allows for image storage of all components ■ Inspection of reel components with an inclined X-ray camera is also possible ■ The VCT function significantly improves shooting operability, enabling not only radiographic inspection but also three-dimensional analysis *For more details, please download the PDF or feel free to contact us.

The "FX-400tRX" is a 3D X-ray stereo inspection device capable of obtaining clear X-ray images with a geometric magnification of 500 times. It can also inspect the connection points of IC wire bonding and copper wires. Additionally, it can inspect through-holes inside printed circuit boards. With a high output of 110kV and 200μA, it has become possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution of 2μm enables image acquisition of fine details ■ High magnification imaging with geometric magnification of 500 times ■ X-ray stereo method allows separation of the front and back surfaces of the mounted circuit board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 500 horizontal cross-sections of the mounted circuit board *For more details, please download the PDF or feel free to contact us.