Non-contact 3D surface shape measurement system
A 3D surface shape measurement module that enables automatic 3D inspection of surface shapes simply by attaching it to the metal microscope installed by the customer.
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basic information
It is ideal for 3D inspection of semiconductor wafer bumps, through-via deep hole measurement, and surface roughness measurement of LCD and OLED substrates.
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Applications/Examples of results
■Features Non-destructive measurement 0.1nm height resolution High linearity capacitive sensor Shape analysis software High-speed measurement ■Main application examples 3D inspection of semiconductor wafer bumps (solder bumps, Au bumps) Surface inspection of semiconductor wafer patterns Surface shape inspection of silicon MEMS (via holes, cavities) LCD column spacer inspection Surface inspection of color filters Surface roughness inspection of organic EL Surface inspection of micro-lens arrays Inspection of metal processing surfaces 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-jisso.jp/3D.aspx Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
