Ideal for manufacturing equipment for substrates such as organic EL!
This is a device that manually loads the substrate for spin coating, performs spin coating of the resist, cleans using an EBR device, carries out pre-bake and post-bake as well as cleaning with a bake unit, develops using a developing device, and manually retrieves the substrate.
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basic information
The system consists of a spin coat device, an EBR device, a bake unit device, and a developing device. 【Device Dimensions】 ● Spin Coat Device: W2000×D1300×H2150mm ● EBR Device: W760×D1100×H1100mm ● Bake Unit Device: W1510×D1700×H1700mm ● Developing Device: W900×D1400×H1400mm 【Work Dimensions】 Maximum 300×300mm
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Applications/Examples of results
Optimal as a substrate manufacturing device for organic EL, etc.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.