It is ideal for film formation on substrates with complex shapes and can also accommodate resin substrates with low-temperature film formation. Additionally, it produces thin films with excellent gas barrier properties.
ALD (Atomic Layer Deposition) is a method for film formation that deposits a single atomic layer in one cycle, forming a thin film by repeating the cycles. It enables uniform layer control at the atomic layer level, allowing for the formation of high-quality thin films with excellent step coverage. 【Features】 ○ Ideal for film deposition on complex-shaped substrates ○ Compatible with resin substrates due to low-temperature deposition ○ Thin films with excellent gas barrier properties can be obtained For more details, please contact us or download the catalog.
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basic information
【Features】 ○ Excellent film thickness control due to the deposition of single atomic layers. ○ Capable of conformal deposition on high aspect ratio substrates. ○ Can deposit while keeping the substrate temperature low. ○ Superior in-plane distribution on the substrate. 【Specifications】 ○ 4-inch diameter substrates, batch processing of 25 pieces. ○ Substrate rotation mechanism. ○ Substrate heating temperature: 25 to 120°C. 【Compatible Film Types】 ○ SiO2 ○ TiO2 ○ Al2O3 ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Applications】 ○ LED (chromaticity adjustment, Ag sulfide prevention film) ○ Electronic devices (insulation film, barrier metal) ○ Gas barrier film, water vapor barrier film ○ Film formation on substrates with complex shapes ● For more details, please contact us or download the catalog.
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Showa Vacuum Co., Ltd. manufactures and sells vacuum technology application devices (vacuum equipment) such as vacuum deposition devices and sputtering devices, primarily focused on equipment that forms thin films on specific substrates in a vacuum.