Heating multiple wafers in a clean environment of Class 1 at a maximum temperature of 450°C with high temperature stability.
Patent technology of laminar flow method The YES PB series chamber features a gas generation plenum at the top and a suction plenum at the bottom, allowing heated gas (typically N2) to flow parallel to the wafer. The parallel laminar flow is effective in removing particles generated on the wafer surface during the heating process. Equipped with a particle removal filter inside the chamber The heated process gas reaches the workpiece through a filter with holes of 100 micrometers in diameter, and after passing through the workpiece, it goes through the filter again before being discharged outside the chamber. This results in a very low amount of particles in the process gas, allowing the wafer to be heated with clean gas. Convection cooling mechanism The cooling of the 450PB is performed entirely from outside the process chamber, ensuring that the processed workpiece is not exposed to cold air. The chamber is surrounded by an independent cabinet equipped with a cooling air inlet and exhaust duct. The heated air cooling the chamber is mixed with ambient air before being exhausted, resulting in a lower temperature during discharge.
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This is a tabletop chamber-type heating oven designed for use in a vacuum environment or inert gas atmosphere (N2, Ar, etc.). The temperature control recipes can be easily set using the touch panel display on the front of the device. Additionally, it achieves highly stable heating treatment in a Class 1 clean environment. There is also a model that supports high vacuum of 1×10-5 Torr (450PB-HV). 【Features】 - Heating treatment in a Class 1 clean environment - Heating up to 450℃ with high temperature stability - Ensures complete removal of oxygen within the chamber (Oxygen concentration below 10ppm, oxygen concentration monitor available as an option) - Maintains a clean environment for the workpiece and chamber after heating treatment using patented laminar flow technology - Cools the chamber without affecting the workpiece during heating through an independent air-cooled cabinet system - Easily create recipes using the front touch panel display, with a memory capacity of 12 different recipes - Reduces gas usage by performing heating treatment in a low-pressure environment within the chamber
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Applications/Examples of results
- Curing of polyimide, BCB (photosensitive resin with heat resistance above 350 degrees), and low-k materials (interlayer dielectric materials) - Curing of polyimide film (insulating film) in WLP (wafer-level packaging) and RDL (redistribution layer formation) processes - Cu, Al annealing - Removal of Cu oxide film, etc.
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