Dual-Sided Simultaneous Exposure Mask Aligner 'BS425' 'BS620'

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BS620

last updated：May 24, 2016

ナノテック

Official site

Simultaneous exposure of both sides of the wafer! Supports medium lot production with semi-automatic operation.

The dual-sided simultaneous exposure mask aligners 'BS425' and 'BS620' have a proven track record in both research and development and small to medium lot production. They adopt a method where the primary exposure is simultaneous on both sides, and subsequent exposures are done one side at a time, making them simple and versatile, with customization available to meet specific needs. Since the secondary exposure and beyond are done on one side, a separate "sample stage" is required. Please feel free to contact us. 【Features】 ■ Supports maximum φ4 inch wafers 'BS425' ■ Supports maximum φ6 inch wafers 'BS620' ■ Compact design ■ Semi-automatic operation possible during primary exposure with a footswitch ■ Easy to accommodate non-standard shape samples due to the hand placement style ■ Equipped with wafer positioning guide (optional) and more *For more details, please refer to the catalog or feel free to contact us.

Related Link - http://www.nanotech-inc.co.jp/index.html

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【Specifications】 ■Applicable Samples 　・Maximum φ4 inches 'BS425' 　・Maximum φ6 inches 'BS620' ■Applicable Masks 　・Maximum opening 5 inches 'BS425' 　・Maximum opening 7 inches 'BS620' 　・Changing mask and wafer sizes requires exchanging the upper and lower mask holders ■Exposure Performance 　・Effective exposure range φ105mm Hg lamp 250W ■UV Intensity 　・Upper side approximately 15mW/cm² or more 　・Lower side 15mW/cm² or more (at 365nm) 　・Illuminance uniformity approximately ±10% ■Exposure Resolution: Line & Space 3μm 　・This is not the final processing accuracy of the device. ■Exposure Method: Contact method (contact pressure adjustable) 　・Proximity exposure possible only on the top surface of the wafer *For more details, please refer to the catalog or feel free to contact us.