It is possible to polish various oxide semiconductor crystals.
Our company possesses the capability to handle processing technology for mass production. Additionally, we also perform polishing processes for substrates used in blue light-emitting diodes and laser diodes. We carry out lapping and polishing processes on a mass production basis to meet the processing specifications required for various applications. 【Processing Details】 ■ Material Names: LiTaO3 (LT), LiNbO3 (LN), ZnO, Quartz, Sapphire, Sapphire Reclaimed, etc. ■ Processing Materials: LiNbO3 (LN), LiTaO3 (LT), ZnO, Quartz, Al2O3 (Sapphire) Backside processing of patterned wafers, reclamation processing, etc. ■ Supported Sizes ・Φ63mm to Φ150mm ・3mm×3mm to 100mm×100mm ■ Finished Thickness: 20μm and above ■ Flatness: TTV: 5μm or less *For more details, please download the materials or contact us.
Inquire About This Product
basic information
If you have any requests, please feel free to contact us.
Price range
Delivery Time
※The delivery date may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
For more details, please feel free to contact us.
catalog（1）
Download All Catalogs
Company information
EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.
![CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]](https://image.mono.ipros.com/public/product/image/941/2000736254/IPROS79608044675729770631.jpeg?w=280&h=280)
