Easy setup, automatic parallel adjustment, complete non-contact gap management. Auto mask aligner with auto-alignment feature. Custom-made options available!
The product is an auto batch equal magnification exposure mask alignment device. It performs automatic parallel adjustment of the photomask and wafer in a completely non-contact manner. Equipped with a super-precise UVW drive stage and high-performance image processing, it accurately aligns the photomask and wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. 【Features】 ■ Complete non-contact parallel alignment and exposure of photomask and wafer ■ Auto alignment function ■ Easy setup changes, compatible with multiple substrate sizes ■ Space-saving and easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precise UVW stage *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Main Specifications】 ■ Mask Size: □3" to □7" ■ Wafer Size: Φ2" to Φ6", Square Substrate □2" to 4" ■ Cassette Stage: 2 sets ■ Centering Unit with Automatic Alignment Function: 1 set ■ Exposure Light Source: Ultra High Pressure Mercury Lamp (250W, 500W), UV-LED Light Source also compatible ■ Equipped with Auto-Alignment Function (Manufactured by FAST) ■ Equipment Size: (Example) 1200×1200×1900 (Main Body) ■ Transport Method: Double Arm Clean Robot (Class 1 compatible) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.