Easy setup, automatic parallel adjustment, complete non-contact gap management. Auto mask aligner with auto-alignment feature. Custom-made options available!
The product is an auto batch equal magnification exposure mask alignment device. It performs automatic parallel adjustment of the photomask and wafer in a completely non-contact manner. Equipped with a super-precise UVW drive stage and high-performance image processing, it accurately aligns the photomask and wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. 【Features】 ■ Complete non-contact parallel alignment and exposure of photomask and wafer ■ Auto alignment function ■ Easy setup changes, compatible with multiple substrate sizes ■ Space-saving and easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precise UVW stage *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Mask Size: □3" to □7" ■ Wafer Size: Φ2" to Φ6", Square Substrate □2" to 4" ■ Cassette Stage: 2 sets ■ Centering Unit with Automatic Alignment Function: 1 set ■ Exposure Light Source: Ultra High Pressure Mercury Lamp (250W, 500W), UV-LED Light Source also compatible ■ Equipped with Auto-Alignment Function (Manufactured by FAST) ■ Equipment Size: (Example) 1200×1200×1900 (Main Body) ■ Transport Method: Double Arm Clean Robot (Class 1 compatible) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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