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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Ashing device
  6. Single Wafer Plasma Ashing System (SWP Series)

Single Wafer Plasma Ashing System (SWP Series)

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SWP Series

last updated:May 12, 2020

神港精機 東京支店
神港精機 東京支店
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Damage-free, high throughput, multi-purpose compatible high-end devices, compound semiconductors, and MEMS. Extensive track record and comprehensive support. New type now available.

Achieved damage-less ashing using downflow plasma while eliminating charge-up damage. High throughput is realized through high-rate ashing with surface wave plasma (SWP) and an ashing chamber equipped with two rooms. In addition to ashing, the RIE chamber enables the removal of special resists and organic films, as well as the removal of hardened resists after ion implantation. It achieves both the removal of hardened resist on the surface and damage-less ashing of the underlying resist. The adoption of a compact single-wafer load lock chamber and twin-hand robots allows for a compact installation size. Proven capability to handle not only standard wafers but also special substrates such as wafers thicker than 1 mm and rectangular substrates. A versatile single-wafer etching and ashing device.

    Etching EquipmentAshing devicePlasma surface treatment equipment
神港精機3(150dpi).jpg

Single Wafer Plasma Ashing System (SWP Series)

神港精機3(150dpi).jpg
神港精機3(150dpi).jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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8-inch compatible single-wafer plasma ashing system. Equipped with two ashing chambers featuring high-density surface wave plasma sources. Includes one single-wafer load lock chamber. Multi-chamber type. Achieves high throughput with compact installation dimensions. Not just for standard ashing processes, but also supports a wide range of applications and processes such as multi-step ashing, various organic film etching, and etching/ashing combined systems, thanks to a rich array of options (RIE chamber, ICP chamber, heating and cooling chambers, additional gas lines).

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Applications/Examples of results

Mass production of compound semiconductors Mass production of magnetic devices Mass production of high-density packaging substrates Mass production of system LSI

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ICP Metal Etching Equipment Brochure

ICP Metal Etching Equipment Brochure

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Single-wafer plasma etching and ashing equipment

Single-wafer plasma etching and ashing equipment

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ICP Etching Equipment Brochure

ICP Etching Equipment Brochure

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Multi-Chamber ICP Etching Equipment Brochure

Multi-Chamber ICP Etching Equipment Brochure

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Plasma Etching Device "EXAM" Brochure

Plasma Etching Device "EXAM" Brochure

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HCD Type High-Density Plasma Etching Equipment Brochure

HCD Type High-Density Plasma Etching Equipment Brochure

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Company information

神港精機

神港精機 東京支店

Industrial Machinery

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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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The related categories of Etching Equipment

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Ashing device
  • Etching Equipment
  • Scientific and Physics Equipment
  • Surface Treatment Equipment
  • Plasma surface treatment equipment
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