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  4. Semiconductor Manufacturing Equipment
  5. Etching Equipment
  6. Large plasma etching device

Large plasma etching device

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last updated:Jun 03, 2022

神港精機 東京支店
神港精機 東京支店
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Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

    Etching EquipmentPlasma surface treatment equipment
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Large plasma etching device

IMG_0127.JPG
IMG_0127.JPG
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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A batch-type parallel plate plasma etching device equipped with a standard 500 mm square stage. It features high-frequency plasma as standard and can switch between RIE and plasma etching modes. Etching and ashing using F-type gases are standard processes, supporting etching and ashing of Si-based, SiO2-based, and SiN-based materials. Additionally, it has a proven track record in various applications, including substrate cleaning primarily using Ar gas and surface modification with O2 gas. Depending on the type and purpose of the substrate, it can be equipped not only with standard parallel plate high-frequency plasma but also with a DC discharge mechanism using pulse DC. Inline and CtoC configurations can be easily adapted to match production volumes, facilitating the transition from prototype lines to full-scale production lines.

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Applications/Examples of results

Wafer-level packaging FPD research prototype Mass production of small electronic components MEMS development and mass production Cleaning and processing of precision machine parts Cleaning and surface modification of semiconductor manufacturing equipment parts and materials

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HCD Type High-Density Plasma Etching Equipment Brochure

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Mass production plasma cleaning device

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Plasma Etching Device "EXAM" Brochure

Plasma Etching Device "EXAM" Brochure

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Plasma Cleaning Device "POEM" Brochure

Plasma Cleaning Device "POEM" Brochure

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Company information

神港精機

神港精機 東京支店

Industrial Machinery

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Shinkou Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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The related categories of Etching Equipment

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Etching Equipment
  • Scientific and Physics Equipment
  • Surface Treatment Equipment
  • Plasma surface treatment equipment
          

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