COM-HPC Server equipped with Intel Xeon D

congatec, a leading vendor of embedded and edge computing technology, has expanded its modular edge server ecosystem. The new products include a server carrier board in the μATX form factor and a COM-HPC server-on-module featuring the latest Intel Xeon D processors (Ice Lake). The new μATX server board for COM-HPC modules is designed for compact real-time servers used in edge applications and critical infrastructure. Along with the new product modules equipped with the latest Intel Xeon D-1800 and D-2800 processors, a space-saving, robust design that meets high-performance requirements is provided on the μATX platform, ready for immediate application use. For the full press release, click here: https://bit.ly/4appdeG

congatec, a leading vendor of embedded and edge computing technology, has announced a new carrier board design training program to share best practices for design methods using state-of-the-art computer-on-modules such as the COM-HPC and SMARC standards. The goal is to enable system architects to quickly, easily, and efficiently delve deeply into the design rules of these PICMG and SGET standards. This training course will explain the fundamentals of design for all mandatory and recommended items of the standards, and by providing best practice schematics for computer-on-module carrier boards, it will allow developers to efficiently start their own carrier board design projects. The focus is on designing carrier boards that comply with the standards, allowing participants to learn about the essential interoperability, scalability, and durability needed to build custom embedded computing platforms. The target audience includes developers from OEMs, VARs, and system integrators.