Photoetching process

basic information

【Other Features】 <Thin Film Patterning of Cu and Cu Alloy Films> ■ Suitable for applications requiring high resistance, such as the electrode parts of strain gauges. ■ Capable of forming fine structures with a minimum size of approximately 10-15μm, such as mesh patterns and comb structures, using a transparent film as the substrate. <Copper Film Patterning (Thickness below 10μm)> ■ Suitable for applications requiring low resistance values, such as antennas and heaters, or circuits that require component mounting. <DITO Process> ■ A technology that patterns stacked films of ITO and Cu deposited on both sides of a film in a single process. ■ Utilized for purposes such as reducing the thickness of the final product. ■ Achieves alignment of pattern positions on both sides with an accuracy of less than 15μm. *For more details, please refer to the related links or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

【Purpose】 ■ Looking for a company that can perform high-precision etching using roll-to-roll processes ■ Looking for a company that can pattern thin films on transparent films ■ Interested in patterning ITO and Cu thin films ■ Want to pattern on both sides ■ Want to perform large-area patterning ■ Looking for a subcontractor capable of mass production through etching processing * For more details, please refer to the related links or feel free to contact us.