13th Generation Intel Core equipped COM-HPC Mini Size Module: conga-HPC/mRLP
The 【conga-HPC/mRLP】 is a COM-HPC Mini Size (95 x 70 mm) module equipped with the 13th generation Intel Core (Raptor Lake-P) processor. The new processor with a hybrid architecture can be selected from seven types (5 to 14 cores) and features up to 64GB of soldered DDR5 memory (6400MT/s). An industrial temperature range option of -40℃ to +85℃ is also available. 【Features】 ■ High performance in a small form factor (credit card size 95 x 70 mm) ■ Supports high-speed interfaces (USB4, Thunderbolt, 10Gbit Ethernet, PCIe Gen4/5) ■ Industrial-grade operating temperature option of -40℃ to +85℃ ■ High durability against vibration and shock
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basic information
Form Factor: COM-HPC Mini Size (95 x 70 mm) Processor: 13th Generation Intel Core Series (previous codename Raptor Lake-P) Memory: DDR5, up to 64GB (up to 6400 MT/s) soldered, IBECC Interface: 2x 2.5 GbE TSN Ethernet (via Intel i226) 2x PCIe Gen 4, 6/8x PCIe Gen 3 Up to 1x USB 4.0, 4x USB 3.2, 8x USB 2.0 Up to 2x SATA, 2x UART, 12x GPIOs Graphics: Integrated Xe graphics, up to 96 EU Commercial Temperature Range: 0℃ to +60℃ Industrial Temperature Range: -40℃ to +85℃
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Robust handhelds and ultra-compact high-performance devices such as tablets.
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Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.