Package removal without causing physical or electrical damage! High selectivity etching.
We provide a device for failure analysis adapted for the packaging of advanced IC and other devices. Our unique new plasma technology, MIP (Microwave Induced Plasma), uses O2 (oxygen) plasma to remove the packaging. Additionally, the device can automatically perform a series of processes including etching, cleaning, and drying within a single unit. 【Features】 ■ Microwave Induced Plasma ■ O2 Plasma ■ Atmospheric Pressure Process ■ Fully Automatic Process *For more details, please refer to the PDF document or feel free to contact us.
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【Process】 ■Plasma Etching ■Ultrasonic Cleaning ■Drying *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company website features information on used equipment related to FPD and semiconductors. ● Main Business Activities Purchase of used semiconductor manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for semiconductor manufacturing lines Purchase of used FPD manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for FPD manufacturing lines Contract development, manufacturing, and sales of semiconductor manufacturing equipment and FPD manufacturing equipment Sales of various equipment parts Agency sales of overseas manufactured equipment
