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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Sputtering Equipment
  6. Backside Metallization Solution "ECLIPSE"

Backside Metallization Solution "ECLIPSE"

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last updated:Oct 09, 2024

プラズマ・サーモ・ジャパン
プラズマ・サーモ・ジャパン
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DC pulse sputtering is possible (reactive sputtering of insulating films using conductive targets)!

"ECLIPSE" is a sputtering device using a side sputtering method for front and backside metallization, as well as for the deposition of dielectrics and piezoelectric materials. It also features a uniquely developed transport mechanism that accommodates ultra-thin wafers and fragile substrates. This device is recommended for engineers facing challenges with continuous deposition and wafer transport in sputtering processes such as backside metallization and under bump metal. 【Features】 ■ Non-contact wafer transport mechanism ■ Compatible with production 150mm wafers (wafer thickness: 250μm) ■ Also compatible with production 100mm wafers (wafer thickness: 130μm) ■ Wafer self-centering capability *For more details, please feel free to contact us.

    Sputtering Equipment
バックサイドメタライゼーションソリューション『ECLIPSE』1.JPG

Backside Metallization Solution "ECLIPSE"

バックサイドメタライゼーションソリューション『ECLIPSE』1.JPG
バックサイドメタライゼーションソリューション『ECLIPSE』1.JPG
  • Related Link - https://www.plasmatherm.com/?s=ECLIPSE

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basic information

【Other Features】 ■ Improved target usage efficiency (up to 40%) ■ High throughput (>50 wafers/hr) ■ High precision substrate temperature control (±7℃) ■ Reactive sputtering capability (O2/N2) ■ Substrate bias function (RF/DC) *For more details, please feel free to contact us.

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Applications/Examples of results

【Applications】 ■ Contact layer / Barrier layer / Interconnect ■ Inkjet applications (piezoelectric thin films) ■ Dielectric films (ceramic targets or metal targets for reactive sputtering) ■ Thin film resistors: NiCr, NiO, SiCr, TaN, TaAlN ■ Transparent conductive films: ITO, AZO, GZO ■ Backside metallization (BGBM) ■ Under bump metallization (UBM) ■ Power device applications (backside electrode film formation) *For more details, please feel free to contact us.

Company information

プラズマ・サーモ・ジャパン

プラズマ・サーモ・ジャパン

Electronic Components and Semiconductors

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Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for over 50 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en

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