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  6. COM-HPC equipped with Intel Core (Series 2)

COM-HPC equipped with Intel Core (Series 2)

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COM-HPC Client Size C: conga-HPC/cBLS

last updated:Jan 20, 2025

コンガテックジャパン
コンガテックジャパン
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COM-HPC Client Size C module equipped with Intel Core (Series 2) (Bartlett Lake)

The 【conga-HPC/cBLS】 is a COM-HPC Client Size C (120x160 mm) module equipped with an Intel Core processor (Series 2) (codename: Bartlett Lake). The processor, based on a performance hybrid architecture, offers three options, featuring up to 16 efficient cores (E-core) and up to 8 performance cores (P-core), supporting a maximum of 32 threads. With four SO-DIMM sockets, it can implement up to 128GB of DDR5 RAM (up to 4,000 MT/s, with ECC as an option). It can be pre-installed with licensed operating systems such as ctrlX OS, Ubuntu, and RT-Linux, and can also be offered as an application-ready aReady.COM product. Target applications include medical imaging, testing and measurement, telecommunications and networking, retail, energy sector, banking, monitoring cameras for traffic, and automation applications such as optical inspection.

    Embedded Board Computers
IM2510P-conga-HPC_cBLS.jpg

COM-HPC equipped with Intel Core (Series 2)

IM2510P-conga-HPC_cBLS.jpg
IM2510P-conga-HPC_cBLS.jpg
  • Related Link - https://www.congatec.com/jp/products/com-hpc/conga…

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Form Factor: COM-HPC Client Size C (120x160 mm) Intel Core 3 201E (4 P-cores 3.6 GHz, 12MB cache) Intel Core 5 211E (6 P-cores 2.7 GHz, 4 E-cores 2.0 GHz, 20MB cache) Intel Core 7 251E (8 P-cores 2.1 GHz, 16 E-cores 1.6 GHz, 36MB cache) 4 SO-DIMM sockets, up to 128GB DDR5 RAM (up to 4,000 MT/s, ECC optional) 2 x 2.5 GbE (TSN support) Intel i226 Ethernet controller 1x16 PCIe Gen 5 (PEG port), 3x4 PCIe Gen 4, up to 3x4 PCIe Gen 3, 1x2 PCIe Gen 3 4 x USB 3.2 Gen2x2, 8 x USB 2.0, 2 x SATA, 2 x UART Up to Intel UHD Graphics 770 (up to 32 EU)

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Medical imaging, testing and measurement, telecommunications and networks, retail, energy sector, banking, monitoring cameras for transportation, and automation applications such as optical inspection.

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Intel Core Processor (Series 2) Equipped COM-HPC Client Datasheet

Intel Core Processor (Series 2) Equipped COM-HPC Client Datasheet

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COM-HPC Client Carrier Board: conga-HPC/uATX Datasheet

COM-HPC Client Carrier Board: conga-HPC/uATX Datasheet

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COM-HPC Client Evaluation Board: conga-HPC/EVAL-Client Datasheet

COM-HPC Client Evaluation Board: conga-HPC/EVAL-Client Datasheet

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Product Guide: Product Highlights 2025

Product Guide: Product Highlights 2025

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News about this product(1)

[Press Release] Congatec Announces New High-Performance COM-HPC Module for Demanding Real-Time Applications - New Performance Enhancements for Computer-on-Module with Intel Core S Technology -

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congatec, a leading provider of embedded and edge computing technologies, has expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COM) with the conga-HPC/cBLS, specifically developed for applications that require high performance, such as edge and infrastructure. The new COM-HPC Client Size C (120x160 mm) module is based on Intel's Core S processor (codename Bartlett Lake-S) performance hybrid architecture, featuring up to 16 efficient cores (E-core) and up to 8 performance cores (P-core), supporting up to 32 threads. This module is designed for demanding applications requiring multi-core and multi-threaded performance, large cache, vast memory capacity, high bandwidth, and evolving I/O technologies. For the full press release, click here: https://bit.ly/3E1RNbo

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コンガテックジャパン

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Electronic Components and Semiconductors

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Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.

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