Next-generation megasonic technology can instantly clear wafers up to 300mm.
The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.
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Modular Mega Sonic Generator (150W) - Output Power: 150W - Output Adjustment Range: Approximately 20% to 100% - Frequency: 1MHz - Power Supply Voltage: 230VAC, 50-60Hz - Enclosure: 19-inch enclosure (3/4U) - Dimensions: 28HP; 165×185×329mm (WxHxD) - Weight: Approximately 4.5kg - Operating Temperature Range: +10℃ to +40℃ (to prevent condensation) FTF Transducer - Dimensions: Approximately 164×50×34mm - Material: PFA - Transducer Element: Special PZT piezoelectric ceramic (butterfly technology) - Conversion Area: Approximately 150×25mm - Output: 150W / 1MHz - HF Cable: PTFE coated coaxial HF cable (total length 3m, of which 0.8m is from the transducer to the matching box)
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Usage and Specific Processes Wafer Cleaning - Capable of single-process cleaning for wafers up to 300mm - A PFA sealed transducer is installed approximately 1.5mm from the wafer to transmit high-efficiency and uniform acoustic energy - Retaining a liquid layer to remove fine foreign substances and particles Photomask Cleaning - Removes dirt from photomasks used in the lithography process of semiconductor manufacturing, maintaining pattern accuracy - Achieves more effective cleaning with up to 40% higher sound pressure compared to conventional systems using "butterfly piezoelectric ceramic" technology Cleaning of MEMS Devices - Applicable to the cleaning of MEMS (Micro-Electro-Mechanical Systems) products using microfabrication technology - Non-contact megasonic cleaning minimizes device damage while removing dirt from precision structures Removal of Microparticles from Display Panels and IC Substrates - Cleaning prior to surface treatment of liquid crystal displays, printed circuit boards (PCBs), and IC substrates - Effective removal of microparticles using 1MHz high-frequency ultrasound, improving manufacturing quality
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps
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