Microgroove processing solutions for semiconductors

Achieving fine groove processing of semiconductor devices with wire-cut electrical discharge machining!

In the semiconductor industry, as devices become more densely packed, the precision and quality of fine groove processing are becoming increasingly important. In particular, the shape, dimensional accuracy, and surface roughness of fine grooves, which influence the performance of wafers and chips, have a significant impact on yield and product lifespan. There is a demand for technology that can process difficult shapes and ultra-fine grooves at equal intervals. Our wire-cut electrical discharge machining technology addresses these challenges and supports the manufacturing of high-quality semiconductor devices. 【Application Scenarios】 - Fine groove processing of semiconductor wafers - Electrode groove processing of IC chips - Fine structure processing of MEMS devices - Processing of other semiconductor components requiring fine grooves 【Benefits of Implementation】 - Improved device performance through high-precision fine groove processing - Increased yield - Extended product lifespan - Enhanced design flexibility

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