High-performance metal seals!! Ideal for various vacuum equipment and semiconductor manufacturing devices!
It is an engineering plastic that boasts excellent heat resistance, low water absorption rate, and outstanding sliding properties.
Silicon nitride, which has heat resistance and excellent thermal shock resistance, is a material with strong mechanical strength and good balance.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
MOCVD, filter, AIXTRON, LED, made in China, high-temperature vacuum dust filtration.
Pipe heaters and cylinders prevent heat loss! Reduce power consumption and CO2 emissions! Shapes and materials can be freely customized according to application!
Can be applied inside pipes with an inner diameter of just 1mm! Excellent in lubrication, corrosion resistance, and release properties, making it suitable for a wide range of applications from kitchen equipment to aerospace devices.
Complete Case Study of Flow Paths: Lock valves with locks and tagged wires! Presenting examples of measures against valve misoperation.
Plasma CVD device for thick film formation. High speed and low stress (patent pending).
Achieving excellent film thickness distribution and reproducibility! Multi-chamber specifications and various custom-made options are also available.
Leave the latest ultrasonic cleaning to Sonosys.
Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
Compact the device size as much as possible! Achieve stable film formation and low particle count.
Introducing one of the largest ultra-large DLC devices in the country!
Metal bellows are components used in various vacuum devices and semiconductor manufacturing equipment.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
It prevents the deposition of powder regardless of the pipe shape, prevents clogging in the pipes through localized concentration, and extends the performance of the pump.
It has excellent properties such as heat resistance, non-stickiness, wear resistance, low friction, chemical resistance, and insulation that cannot be obtained with other resin coatings.
It has excellent properties such as heat resistance, non-stickiness, wear resistance, low friction, chemical resistance, and insulation, which cannot be obtained with other resin coatings.
Type 3 of fluororesin: FEP (Tetrafluoroethylene-hexafluoropropylene copolymer)
At Daito Kasei, we can apply fluororesin coating and fluororesin lining to the inner surfaces of thin pipes ranging from 8A to 25A.
Fluororesin tube lining is a lining technology that involves bonding a fluororesin tube (with an inner diameter of 3mm or more) to the inner surface of a metal pipe through baking.
The horizontal tolerance is +0.2/0-0mm, and the thickness tolerance is +/-0.05mm! Let me introduce the electronic grade CVD.
We offer a lineup of sizes ranging from 3.0x3.0mm to 10.0x10.0mm!
Designing thermal conductivity from 1,000 W/mK to over 2,000 W/mK! Introducing polycrystalline thermal materials.
The horizontal tolerance is +0.1/0-0mm! Introducing single crystal mechanical components.
We offer a lineup of sizes ranging from 3.0x3.0mm to 10.0x10.0mm!
The AgniTemp-MOCVD in-situ temperature monitor developed by Agnitron is a highly accurate and stable temperature monitor.
An in-situ monitor that measures wafer stress, warpage, curvature, anisotropy, etc., in various vacuum devices in real-time and with high precision.
The passivation MBE device is composed of various chambers specially designed for laser facet passivation and other purposes.
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
TiC treatment and TiCN treatment are possible! It can be used under harsher conditions than PVD treatment.
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Fluororubber with excellent long-term durability!! It can withstand high temperatures (200-220°C) compared to conventional fluororubber.
ALD (Atomic Layer Deposition) equipment dedicated to particles can deposit films on nanoscale particles.
What are the value criteria for devices sought by device manufacturers? KITZSCT helps improve space-saving design and construction efficiency for exhaust system lines.
Currently presenting a summary of three particularly popular case studies! Changing the valve can also reduce the incidence of troubles. A collection of safety measures to protect workers from danger.
Eliminate concerns about vacuum piping equipment! Presenting examples of measures against degradation of centering due to plasma and heat.
Control of ion density by ICP power! Achieving low-temperature film formation, low damage, and high conformality.
Compatible with SI 500-1M, SI 500 PPD-1M, etc.! The transport chamber is available in three types.
The maximum film-forming temperature is 800°C! It can accommodate up to 4x DLI evaporators with the chamber heating mechanism.
CVD coating equipment that can be used without restrictions on any shape of item.
For the output return line of the pulse power, Kurita Manufacturing proposes a copper flat plate.
It includes a comparison of blade dicing and plasma dicing.
As a result of GaN microLED mesa processing, we have published emission spectral data during the GaN microLED mesa processing!
Demo available at our company! New technology launched in the market. CVD with atmospheric pressure plasma. Capable of handling small quantities and a variety of products.
With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.
【 Campaign for surpassing 4,000 units sold is underway 】 Our transfer rods use a magnetic system and are suitable for use in ultra-high vacuum environments.
It is suitable for use in primary bulk gas lines with a flow rate of 500 L/min to 3,000 L/min.
It will lead to cost reduction by shortening the installation time.
It is a compact DIN size [48mm (W) × 24mm (H) × 66mm (D)], and digital scaling can be operated from the front.
Non-contact transport device for gripping ultra-thin warped wafers without touching them.
Small quantities and wide varieties. NSG(SiO2)/PSG/BPSG deposition. Single-wafer processing atmospheric pressure CVD (APCVD) system (Compatible with 8-inch SiC wafers)
4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD.
Involved in the manufacturing of both development and mass production machines, achieving manufacturing and mass production in a short period!
Proposed simplifications for harness processing, introduced software for harness inspection, and achieved mass production!
Machined parts of semiconductor manufacturing equipment A5052 round [Leave cost reduction to Philir Co., Ltd.]
Aluminum semiconductor device parts processing [Leave cost reduction to Philir Co., Ltd.]
Aluminum processing, anodizing treatment, Osaka [Leave cost reduction to Philir Co., Ltd.]
Aluminum cutting / A5052 / Lathe processing / Osaka [Leave cost reduction to Firiru Co., Ltd.]
CNC lathe processing, aluminum precision cutting, semiconductor manufacturing equipment parts [Leave cost reduction to Philir Co., Ltd.]
Cost reduction with functional aluminum frames and a wide range of accessories [Available not only as individual items but also as "assembled products" in flat or three-dimensional configurations!]
Sales of aluminum frames up to 5800 mm are possible! Additionally, we also accept "assembled products" such as exterior booths! Compatibility with other companies is also available.
The finished outer diameter is φ12.7. It is a composite processing of friction stir welding and electron beam welding. Joining of dissimilar metals is possible.
A very compact atomic layer deposition device with a rich process recipe.
Piping components are materials applied in various vacuum devices and semiconductor manufacturing equipment.
Early detection of liquid leaks to minimize accidents! The OD-7, compliant with RoHS and CE, has been added to the oil and organic solvent detectors.
Chemical reactions caused by dilute gases can also be considered!
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
Plasma CVD equipment compatible with wafer sizes of Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities.
Simulation of vacuum exhaust and analysis of gas flow under low pressure conditions, analysis software compatible with rarefied gases (rarefied fluids).
Three types of sedimentation devices are available! Please choose according to your needs.
We provide vacuum deposition equipment and related maintenance services.
- A wide range of standard-sized products - Easy installation - Precision sintering diffusion bonding (simultaneous sintering) - High flow rate
MOCVD equipment VEECO K465i G2
Leave the technical services for semiconductor manufacturing equipment to us.
Not only can we achieve significant cost reductions by utilizing used equipment, but we also offer affordable support for after-sales service, maintenance, and specification changes after installation.
Forming a dense thin film by chemically reacting gases! Low-temperature processing is also possible.
AtomSpectraDBViewer: Fast and convenient search! New version now available!
Nisshin Giken Co., Ltd. - Single Crystal Growth Equipment - Comprehensive Catalog Available for Free Distribution!
A compact and space-efficient device! The substrate supports φ4 inch, and it comes with a heating mechanism and T/S variable mechanism!