The O-ring cherry seal molds O-rings of various sizes according to the AS568 standard (aerospace standard) and other specifications, using a wide variety of materials.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
Early detection of liquid leaks to minimize accidents! The OD-7, compliant with RoHS and CE, has been added to the oil and organic solvent detectors.
Since the pipe is narrow, we can solve the problem of the adhesive clogging or corroding in a short time!
A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
Semiconductors, components for liquid crystal manufacturing equipment, heat-resistant and corrosion-resistant materials, setters, and heat dissipation plates!
This is a completely new DLC coating device from Japan that also allows for gas ion injection.
Controllable extensive membrane properties! Significant particle reduction and improved productivity.
Bernoulli chuck for non-contact transport of wafer chips, high-temperature wafers, lenses, and micro-objects.
4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD.
UHP/UHV, ultra-high purity, ultra-high vacuum, advanced metal sealing solutions for ultra-low temperature.
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!
Introducing one of the largest ultra-large DLC devices in the country!
- A wide range of standard-sized products - Easy installation - Precision sintering diffusion bonding (simultaneous sintering) - High flow rate
The O-ring cherry seals are made from a special material that can withstand harsh temperature conditions and strong chemicals, and they are molded into various sizes.
Standard type perfluoroelastomer material with O-ring cherry seal.
Standard type 3-component fluororubber material with O-ring cherry seal.
White type of Bition ETP (FFKM-E) material with O-ring cherry seal.
The O-ring cherry seals are available in a wide variety of materials with various properties such as heat resistance, pressure resistance, and chemical resistance, and can be molded in various sizes.
High hardness type Afuras (FEPM) material with O-ring cherry seal.
Not only can we achieve significant cost reductions by utilizing used equipment, but we also offer affordable support for after-sales service, maintenance, and specification changes after installation.
It prevents the deposition of powder regardless of the pipe shape, prevents clogging in the pipes through localized concentration, and extends the performance of the pump.
Compact and energy-efficient! Plasma CVD equipment for synthesizing single crystal high-purity diamonds for device fabrication.
Type 3 of fluororesin: FEP (Tetrafluoroethylene-hexafluoropropylene copolymer)
Here are some examples of our construction achievements. Fluorine coating case study 2: Various industrial products.
It is an introduction device that transmits linear motion from the atmospheric side to samples and equipment in a vacuum.
Nisshin Giken Co., Ltd. - Single Crystal Growth Equipment - Comprehensive Catalog Available for Free Distribution!
An in-situ monitor that measures wafer stress, warpage, curvature, anisotropy, etc., in various vacuum devices in real-time and with high precision.
There is a track record of growing nitride semiconductor crystals on various semiconductor substrates. Customization is also possible according to your requests.
We can accommodate a variety of materials and specifications.
We offer a lineup of sizes ranging from 3.0x3.0mm to 10.0x10.0mm!
Designing thermal conductivity from 1,000 W/mK to over 2,000 W/mK! Introducing polycrystalline thermal materials.
Suitable for commercial use! It has very stable and predictable characteristics and behavior.
Total support for the installation and maintenance of semiconductor manufacturing equipment, from precision equipment installation compatible with clean rooms! Additional information.
We alternately stack polyparaxylylene (Parylene) and inorganic oxide layers using atomic layer deposition (ALD).
High-performance metal seals!! Ideal for various vacuum equipment and semiconductor manufacturing devices!
Attention those struggling with byproduct management in the front section of pest control devices or CVD exhaust lines! We present a case study on suppressing byproducts using a high-temperature (180°C) valve!
Pressure sensors for various integrated gas systems.
It demonstrates extremely high corrosion resistance and outstanding performance against halogen-based reactive corrosive special gases.
The filter membrane is made of PTFE and has a two-layer structure.
It does not cause the generation of particles or chemical reactions due to corrosion.
Used semiconductor manufacturing equipment
Various plasma sources can be equipped! Customized design for CVD, MOCVD, and ALD equipment.
Online sales of small packs, just what you need when you need it!
For the output return line of the pulse power, Kurita Manufacturing proposes a copper flat plate.
High-power high-frequency power supply for plasma and laser applications.
Plasma CVD device for thick film formation. High speed and low stress (patent pending).
We are publishing new data on the non-bosch process for silicon.
Installation and manufacturing of gas supply systems for semiconductor and solar cell manufacturing equipment.
Water-repellent coating with plasma treatment. Compatible with resin films through low-temperature processing. Development support through sample testing. Compact type plasma surface treatment device.
You can convert thermal conductivity into pressure and perform vacuum measurements.
High-purity carbon is used extensively in the ion implantation process of semiconductor manufacturing, which requires high purity. Here is an introduction to high-purity carbon.
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.
For prototyping, development, and small lot production For deposition of NSG(SiO2)/BSG/PSG/BPSG Batch processing (simultaneous processing of multiple substrates) APCVD system
Small quantities and wide varieties. NSG(SiO2)/PSG/BPSG deposition. Single-wafer processing atmospheric pressure CVD (APCVD) system (Compatible with 8-inch SiC wafers)
Precision parts for semiconductor manufacturing equipment 【Leave cost reduction to Philir Co., Ltd.】
Aluminum five-axis machining Osaka [Leave cost reduction to Philir Co., Ltd.]
Aluminum processing, anodizing treatment, Osaka [Leave cost reduction to Philir Co., Ltd.]
No need to change the size or number of existing bolts? A must-see for those struggling with "wanting to eliminate gas permeation and gas release from vacuum rubber O-rings" in semiconductor manufacturing equipment!
Explaining the benefits of aerogel products that can be used in high-temperature environments!
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!
Compact the device size as much as possible! Achieve stable film formation and low particle count.
A very compact atomic layer deposition device with a rich process recipe.
Silicon nitride, which has heat resistance and excellent thermal shock resistance, is a material with strong mechanical strength and good balance.
Three types of sedimentation devices are available! Please choose according to your needs.
Metal bellows are components used in various vacuum devices and semiconductor manufacturing equipment.
Simulation of vacuum exhaust and analysis of gas flow under low pressure conditions, analysis software compatible with rarefied gases (rarefied fluids).
Chemical reactions caused by dilute gases can also be considered!
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
Plasma CVD equipment compatible with wafer sizes of Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities.
We provide vacuum deposition equipment and related maintenance services.
MOCVD, filter, AIXTRON, LED, made in China, high-temperature vacuum dust filtration.
MOCVD equipment VEECO K465i G2
White type perfluoroelastomer material with O-ring cherry seal.
White type of ternary fluorine rubber material with cherry blossom seal of O-ring.
Heat-resistant trivalent fluorine rubber (high temperature resistance: 250°C) material with O-ring cherry seal.
White type heat-resistant perfluoroelastomer (high temperature resistance: 280°C) material with O-ring cherry blossom seal.
Standard type Bition ETP (FFKM-E) material with O-ring cherry seal.
Standard type Aflas (FEPM) material with O-ring cherry seal.
Low adhesion and low outgassing fluororubber (FKM) material with O-ring cherry seal.