We protect the environment with dry cleaning plasma technology and significantly improve the productivity of semiconductor devices.
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
We have a proven track record for customers in OSAT around the world and have established our position with reliable performance.
"Plami-α" is a compact and user-friendly atmospheric pressure plasma generation device. It can be easily used for surface modification and activation anytime, anywhere!
From batch processing equipment equipped with unique wafer transfer machines to sheet processing equipment, they are used in fabs around the world for MEMS and semiconductors.
Industry's smallest size! Compact and low-cost tabletop plasma treatment device.
Compact and low-cost tabletop plasma treatment device Harrick Plasma PDC-001 / Plasma Cleaner
A plasma cleaner that can be customized to meet your needs.
50-piece batch plasma ashing system (asher) compatible with 6-inch and 8-inch wafers. There is also a wafer single-piece processing type available.
Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.
It is a versatile and compact device that enables etching, ashing, and ion cleaning!
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
Batch-type plasma ashing device for 50 wafers at once.
Single-wafer plasma etching processing device (single-wafer plasma etcher)
Plasma processing device (multi-purpose plasma etcher)
Cleaning equipment, UV/O3 cleaning equipment, dry cleaning equipment, cleaner (cleaning device), stripper (stripping device)
Dry etching equipment, reactive ion etching equipment, compact etcher, ashing equipment, cleaner (cleaning equipment)
![UV装置[1].jpg](https://image.mono.ipros.com/public/product/image/de4/2000425947/IPROS87366773039968963467.jpeg?w=280&h=280)
Damage-free, high rate, large area compatible, complete removal of ion damage, achieving complete radical processing. High-performance plasma ashing device.
Supports automated mass production lines. Inline type, sheet type, and various types with flexible hardware configurations, all with a proven track record of high effectiveness of vacuum plasma in mass production lines.
A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.
Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.
Equipped with a new plasma source HCD (hollow cathode discharge) electrode, capable of etching various metals and Cu thin films. A new type of etching device that also facilitates large-area processing.
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.
Small Plasma Cleaner (Simple Sheet-Type Plasma Cleaner)
Damage-free, high throughput, multi-purpose compatible high-end devices, compound semiconductors, and MEMS. Extensive track record and comprehensive support. New type now available.
H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)
A5056 processed products, individual items, machining processing [Leave cost reduction to Philir Co., Ltd.]
SUS304 Machining / SUS304 Cutting
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.
"TSP" protects the line from product defects caused by instantaneous voltage drops and damages from equipment failures.