It is suitable for visual inspection of wafers, lenses, and glass substrate surfaces.
It is a manufacturer of IC programmers certified by major semiconductor manufacturers worldwide, produced by "Leap Corporation" in Taiwan.
We deliver products that make life simpler and more comfortable.
This is the field in which our company VBPC excels the most.
Consolidating decades of technology developed with contact probes for semiconductor testing!
Applying our technology and global technologies! Contributing to the development of new products and improving productivity for our customers.
A soundproof shield room that combines electromagnetic shielding performance and sound insulation performance, creating an excellent inspection environment!
We will introduce product information by genre for various precision tools and fixtures used in semiconductor manufacturing, as well as individual product specifications.
We propose improvements to tester capabilities in line with production quantities.
Justem Co., Ltd., manufacturer and seller of measuring machines, processing machines, dedicated machines, and automation equipment.
Leave the production of unique and customized lathe-processed parts to us.
We provide a one-stop service from semiconductor test development to the launch of semiconductor testing and semiconductor testing outsourcing.
Would you like to achieve efficiency in repair and maintenance inspection operations and improve customer satisfaction with the core business package "ServAir" for after-sales service?
Resistance Rate / Sheet Resistance Measuring Instrument 【EC-80】
Resistance rate / Sheet resistance measuring instrument [RT-3000/RG-1000F]
Stainless steel 316, high temperature and high pressure compatible T-type and inline filter 'H-600 series'. This filter allows for element replacement.
The semiconductor curve tracer is a state-of-the-art device capable of handling a maximum peak of 3000V and a maximum peak current of 1000A.
Coreless rod type, small linear motor actuator.
Air supply on-off manual operation non-contact wafer tweezers
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
Adopting electrically neutral atomic beams! Surface analysis equipment that solves charging issues.
We provide support from reliability testing to failure analysis reports!
High-precision alignment (within 1μm of the target) is now possible in all directions of X-Y-Z-θx-θy-θz.
LUL can provide proposals tailored to your specifications! We accommodate a variety of automation requirements.
Super engineering plastics / machining / extensive experience in various industries such as semiconductor equipment, medical device parts, and food machinery parts!
Our company has established a comprehensive production system that includes not only difficult-to-machine materials processing and metal machining, but also design, processing, assembly, and inspection.
This machine is a device for measuring the thickness of φ8” silicon wafers.
TFE electron gun, high-voltage power supply device "FE503XP" for electron beam lithography!
Custom design and production available according to customer requests!
The CS series is a handler for memory, designed for Pick & Place type substrates.
Developed a dicing frame (wafering) using CFRP 3D printing technology. It is lightweight and has high rigidity, making it excellent for wafer transportability.
Resistance rate / Sheet resistance measuring instrument [WS-8800]
From noise countermeasures for AC lines to the relationship between resolution and noise. A free gift of the "Noise Countermeasure Know-How Collection" for electronic and electrical circuit designers.
The measurement medium temperature ranges from -10°C to a maximum of 300°C.
Developed a gas filter with a high filtration accuracy of 0.003 μm in a consistently stable state.
The SPC series is designed to be ultra-compact (φ21×84mm) and lightweight (90g).
It will lead to cost reduction by shortening the installation time.
CDSEM, boasting an overwhelming market share, along with the Hitachi S8000 and S9000 series. We have a constant inventory of equipment and a complete demonstration system in place.
The world's only spectroscopic ellipsometer technology for measuring pore rate and pore distribution using an EP (optical porosimeter).
Effective for analyzing defects and crystal defects! Equipped with interfaces for a wide range of cryostats.
Non-destructive/non-contact! Detection and monitoring of expansion defects inside wafers at the nm scale is possible.
Easily create cross-sectional observation samples for SEM! Marking is possible with a positional accuracy of ±2.5μm.
Helicoils, which are often incorporated into design specifications. By embedding them into the base material, they enhance thread strength and allow for repeated use!
Ultra-low temperature (-70℃) compatible handler, SLT compatible.
Standard equipment with all necessary components for probing! A probing system with excellent cost performance.
This is an MBE device compatible with compact sizes (1 inch to 2 inches).
Chip, Melf, lead-type resistor sorting machine
Design and manufacturing of semiconductor-related equipment (backend process)
An essential tool for measuring wafer temperature distribution.
The nano-resolution piezo positioning stage is used in various fields around the world, so you can use it with confidence.
High-flexibility high-strength cable. Ideal for industrial robots and automatic machinery!
Easy operation with a test setup application featuring automatic position detection! Meter panel automatic evaluation system.
Crystal orientation and pole production are evident in 15 minutes! Stable surface analysis is possible without the influence of charging! Time-of-flight atomic scattering surface analysis device [We accept analysis requests!]
A group of masters in semiconductor polishing processing.
TO220 series device high temperature measurement inspection equipment
A device for laser marking on semiconductor frames. Achieves high-speed transport of frames without jamming through a unique grip transport mechanism!
We have established a consistent work system from design, parts manufacturing, assembly, control, to delivery.
Laser shape processing: Cutting of brittle ceramic materials.
- Equipped with a temperature gradient generation unit that directly applies heat to the sample - Equipped with a micro-infrared camera unit
Achieving probing compatible with multiple simultaneous measurements! Correcting misalignment after dicing.
To customers considering wide-width equipment for roll-to-roll production lines.
The layered metal mesh filter offers more options for mesh opening size and thickness (number of layers). Additionally, adding a radius to the corners makes it easier for materials to enter.
Double table/shuttle type! Inspection equipment for FC-CSP/large individual chip substrates.
Overall alignment accuracy ±2.5μm! Inspection equipment for large individual pieces/quarter panels.
We accommodate various needs such as analog circuit design, high-speed circuit design, and differential wiring.