Realization of low Ra using high-quality grinding tape.
Ultra-fine tungsten core diamond wire is a material for next-generation semiconductor production.
We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.
We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!
The gloss of iron and stainless steel is restored with mirror polishing! Tips for successful mirror finishing without failure. What is mirror finishing? Can the mirror surface of metal be revived through polishing?
The metallic luster is restored with a polished mirror finish; let's regain a like-new shine through polishing!
High precision and mass production are achievable with grinding processing utilizing bearing machining technology!









































































































































