We equip our company with processing machines tailored to our know-how! This allows us to provide highly reliable products to our customers.
A dedicated belt grinder designed for incorporation into robots and devices. It has the highest output in the lineup, suitable for heavy grinding of castings and welded parts.
Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!
No special tools are required! The three processes of drilling, pulling, and end face machining can be easily performed with one machine.
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
An automatic polishing machine specialized for "reproducibility"! It is a single unit that also excels in maintainability.
Safe and efficient semiconductor wafer transport containers! A wide lineup is available. Compatible with various wafer sizes.
Introducing a diverse lineup of polishing machines, including polishers and buffers!
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
A polishing machine that can be used widely for the shaping and polishing of brittle materials, compatible with gemstones and optical glass!
It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
A polishing and grinding system based on diverse and highly reliable technologies that pursues the production of high-quality samples.
Easy to operate for anyone! A compact, space-saving centerless grinding machine.
Just gently insert the work! We will fulfill your wish to easily polish it.
You can quickly find the perfect polishing tool for your needs and preferences!
Leave the automation of metal polishing, grinding, and deburring to FUJIYA TECH.
Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!
A simple and efficient grinder! Easy maintenance with removable parts, etc.
Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
Non-contact tweezers for 300mm high refractive index glass wafers
For grinding and polishing work that generates sparks, such as with whetstones and belts! Automatic water suction is possible with plumbing using tap water!
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
There are three types of whetstones! You can freely bevel high curve lenses and low curve lenses.
A new idea from "painting and sticking" to "polishing"!
2 inches; 3 inches; 4 inches; 5 inches; 6 inches; 8 inches; 12 inches. Dummy wafers available for each grade up to prime wafers.
This is a filter that uses ceramic (alumina) spheres. Since spherical shapes are used, the filtration accuracy is uniform.
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
Save cleaning time! The durable die-cast body provides robustness and stability.
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.
Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
Easy operation and compact design! A metalworking drill sharpener that pursues ease of use.
Easy operation and high precision! The standard drill sharpener compatible with a wide range of drills.
Auto-lamination without bubbles under preset pasting conditions.
Improvement of work parallelism! It is possible to de-bubble air and other contaminants that were mixed in during wafer attachment.
We have considered ease of use with a simple design that is necessary and minimal.
We will accelerate your business through regular exchanges/repairs.
The cross-section of electronic components is simple and finishes beautifully!!
Innovative electro-polishing equipment for yellow gold, red gold, white gold, and silver.
The price is back at a low cost! Introducing the upgraded automatic polishing machine MECATECH 334.
Ideal for post-CMP cleaning of wafers! Achieves high cleanliness with special cleaning.
Robust welding structure! It can maintain high-speed and stable operation even during long hours of continuous operation.
Multiple magnetic plates are provided to rotate, and the magnetic plate axis also revolves! Processing can be done uniformly across the entire surface of the container.
It's an entry-level model, but it has high versatility! It can handle both rough and finished work with just this one machine.
The technical team of the end mill manufacturer is regrinding! It comes back to life at about one-third the price of a new one!
We provide reliable support from the sale of internal and external mold materials to processing.
Achieve fast and clean finishes on all types of materials! A honing machine that enables stable processing.
We accommodate various shapes with handwork processing! We achieve finishes tailored to your preferences.
We perform chemical polishing of copper, brass, and iron!
Built-in 10 types of polishing/etching conditions suitable for various materials! Short polishing time and high reproducibility.
The dimensions of the height and width of processed stone can be easily set using a diagonal two-point setting method on a fully automatic side grinding machine.
A simple structure that anyone can handle! A rotary barrel polishing machine that can polish various materials and shapes.
Bringing unseen innovations to life through technological prowess. The expanding realm of technology provision.
A non-woven fabric-based polishing pad that responds well to various applications.
Low wear on the whetstone for long-lasting use! Water-cooled circulation automatic sharpening machine that suppresses blade overheating.
Widely available! A belt sander that allows for easy belt replacement.
Energy-saving and high airflow effectively capture fine dust within the factory.
Join wafers and bulk without applying heat!
It is a polishing device that demonstrates its effectiveness in correcting tire uneven wear and restoring grip.
Durable and long-lasting! Double action with two functions: cutting and grinding in one machine!
Maintain a comfortable working environment with dust collection! No consumables needed for rust prevention of compounds in wet processes.
High adhesion to prevent water infiltration! We offer two types of protective tape for back grinding processes: UV type and Non-UV type!
Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!
Capable of grinding processing and wafer inspection! Developed to meet new tape and customer requirements.
Cost reduction of over 40%! Cost reduction proposal service utilizing processing equipment.
From procurement of pressing, forging, and cutting processing to consistent support for polishing and grinding processing!
Added outer diameter grinding processing! Contributed to total cost reduction.
Select the appropriate grinding method according to the production volume! Easily achieve VA/VE for parts.
As the production quantity increases, it becomes possible to reduce the total cost.
We have reduced the need for Kaeri processing in paper handling.
High precision and mass production are achievable with grinding processing utilizing bearing machining technology!
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
The brush mechanism allows for the removal of burrs and chips generated during cutting.
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.
We provide surface finishing at the nano level, from single crystals to metals, ceramics, and resins! Detailed explanations of applications and evaluation points are available.
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
Polishing equipment that maximizes the characteristics of polishing film.
This is a cutting resin processed product using Sumika Super S1000 (formerly known as Econol). Leave high-precision resin processing to us, with a minimum estimate of half a day.
Realization of low Ra using high-quality grinding tape.
[Made in Japan] Precision Grinding Tape Used
Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!