A simple and efficient grinder! Easy maintenance with removable parts, etc.
Adopts motor drive! Dust-free and suitable for clean rooms.
Safe and efficient semiconductor wafer transport containers! A wide lineup is available. Compatible with various wafer sizes.
Achieve an even finish without polishing marks through "planetary motion" with a rotary 4-axis buff!
Just gently insert the work! We will fulfill your wish to easily polish it.
Durable and long-lasting! Double action with two functions: cutting and grinding in one machine!
Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!
Ideal for post-CMP cleaning of wafers! Achieves high cleanliness with special cleaning.
Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!
Many delivery achievements! Standard centerless grinding machine suitable for polishing pipes and bar materials.
Adopting a special sanding roll! You can easily position it with a single touch by entering the desired dimensions.
[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
No special tools are required! The three processes of drilling, pulling, and end face machining can be easily performed with one machine.
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
Complete automation is possible by installing an automatic supply extraction device and an automatic pressurization device!
3D metal powder molded parts with complex shapes, R shapes, and spiral shapes can be polished to a mirror finish, even with fine pores!
Learn about fluid polishing technology through data! Our mirror finish has an ultra-mirror surface with an Ra value of 0.01μm.
An automatic polishing machine specialized for "reproducibility"! It is a single unit that also excels in maintainability.
Leave the automation of metal polishing, grinding, and deburring to FUJIYA TECH.
A standard tabletop polishing device that meets a wide range of requirements from research and development to production.
The squeegee used for pushing paste in a screen printing machine is a very important consumable part at the end of the process that determines printing accuracy.
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
A necessary item for lawn mower maintenance, used for intermediate finishing until the blade is sharpened!
Save cleaning time! The durable die-cast body provides robustness and stability.
Ideal for line integration due to its fixed base design! The sanding roll can be eccentrically adjusted using a ratchet handle.
Auto-lamination without bubbles under preset pasting conditions.
Even fine-grained abrasives can be easily handled! It can produce a finished surface with minimal roughness on the workpiece.
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
Bubbles-free application possible! Non-contact type for patterned surfaces can also be produced.
Multiple magnetic plates are provided to rotate, and the magnetic plate axis also revolves! Processing can be done uniformly across the entire surface of the container.
There are many advantages to metal pearlescent processing! What is its compatibility with plating? What are the methods for pearlescent finishing of stainless steel? Pearlescent finishing of stainless steel is highly compatible with plating.
It is possible to bond substrates and resin substrates coated with adhesive in a voidless manner for lamination in a vacuum.
We contribute to the creation of true value and the evolution of innovation through high-performance machines such as grinders and dust collectors.
It is a polishing device that demonstrates its effectiveness in correcting tire uneven wear and restoring grip.
Consistent support from sales proposals to design, manufacturing, and delivery! Transforming production through tool regrinding.
Easy setup and operation! A compact and low-cost small diameter hole polishing machine!
Capable of handling various grinding tasks! It produces minimal dust dispersion and provides a quiet working environment.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
A dedicated belt grinder designed for incorporation into robots and devices. Suitable for fine deburring, chamfering, and finishing.
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
Achieving a size and low price that large companies cannot offer. With a compact design that is easy to introduce into laboratories, customization to specifications that match wafers and special substrates is also flexible.
Ideal for polishing wooden materials such as furniture components and fittings! Easy operation with a color graphic control panel.
An air cylinder is used for driving the extension stage. The simple design achieves maintenance-free operation.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
Helicoils, which are often incorporated into design specifications. By embedding them into the base material, they enhance thread strength and enable repeated use!
Achieving high-quality polishing that preserves the edge through automation.
Ultrasonic polishing device suitable for processing the corners of discharge targets!
A pen-type sandblasting machine suitable for surface treatment of fine parts (without blast cabinet / direct pressure and suction type).
We will process SiC and GaN substrates using the CARE method!
A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!
A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!
It employs a high-rigidity, high-precision barrel cam that demonstrates excellent indexing characteristics.
No more inefficient saw cutting machines! Please consider using our system at least once.
The dimensions of the height and width of processed stone can be easily set using a diagonal two-point setting method on a fully automatic side grinding machine.
For deburring and surface polishing of precision small parts! Powerful polishing processing or delicate finishing processing can be done in a short time.
Innovative electro-polishing equipment for yellow gold, red gold, white gold, and silver.
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
Achieve fast and clean finishes on all types of materials! A honing machine that enables stable processing.
Surface grinding is possible without removing the roll! It keeps the roll surface in optimal condition.
Introducing a diverse lineup of polishing machines, including polishers and buffers!
We are currently offering a comprehensive catalog of grinding machines, polishing machines, and dust collectors! It includes dust collectors that compactly house buffing machines and cyclones with filters inside the unit!
A cyclone and filter in one unit! A dust collector with low filter dust load.
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
A rice husk grinder that can directly accept the husks coming out of the rice milling machine!
Easy to install! Can polish 4 sheets simultaneously, reducing work time! A long-lasting automatic polishing machine with a rotating mechanism.
A non-woven fabric-based polishing pad that responds well to various applications.
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This is a new silicon wafer edge polishing device developed with the concept of space-saving and high throughput.
High-Spec Dedicated Load Grinding Device
I'm graduating from hand polishing!
~Me, Kenma, and IMT~
Achieving high machining precision with one chucking! Grinding technology that processes both inner and outer diameters simultaneously.
Can be processed under suitable conditions! Even beginners can operate it easily.
The brush mechanism allows for the removal of burrs and chips generated during cutting.
We propose our polishing equipment to address the concerns of automotive parts manufacturers.
An innovative magnetic levitation centrifugal pump that does not use bearings with a lifespan or wear-prone seals!
Tungsten core wire is the core wire for next-generation semiconductor production diamond multi-wire saws.
Polishing equipment that maximizes the characteristics of polishing film.
【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
Added outer diameter grinding processing! Contributed to total cost reduction.
Compatible with a wide range of materials! It adapts to endless belts, improving work efficiency.
Reduce the burden on operators! Equipped with a copying device, automatic return device for processed materials, and automatic pad device as standard.
With One Pass, rough grinding to finishing polishing is possible! The thickness display device makes it easy to see the thickness settings at a glance.
Minimum processing thickness 0.2mm! Suitable for grinding materials like veneer, with a height-adjustable flat surface.
Powerful chamfering beveller capable of chamfering up to 10C. Easy to work with round and long holes!
It demonstrates sufficient curing performance (cured state, curing speed) compared to high-pressure mercury lamps and metal halide light sources.
A device that can accommodate both pre-cut tape and normal tape.
Manual wafer mount for pre-cut tape.
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
The basics of polishing involve the maintenance and management of the precision of the polishing pads. It is dangerous if symptoms such as the following are observed.
PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).
The Precision series features an integrated module structure that makes it easy to incorporate into devices.