[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!
We have compiled frequently asked questions, such as what materials can be cut with a laser.
Safe and efficient semiconductor wafer transport containers! A wide lineup is available. Compatible with various wafer sizes.
Buff polishing machine with a transmission device that can be adjusted to the appropriate rotation speed for the type and size of the buff!
A non-woven fabric-based polishing pad that responds well to various applications.
Multiple magnetic plates are provided to rotate, and the magnetic plate axis also revolves! Processing can be done uniformly across the entire surface of the container.
A polishing machine that can be used widely for the shaping and polishing of brittle materials, compatible with gemstones and optical glass!
A dedicated machine for single crystal diamond tools! Equipped with ultra-precision air bearings in a cast structure that enhances absorbency.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
Ultrasonic polishing device suitable for processing the corners of discharge targets!
When the work is placed inside, it rolls vigorously due to the electrically generated magnetic field! A beautiful surface can be obtained in a short time.
There are many advantages to metal pearlescent processing! What is its compatibility with plating? What are the methods for pearlescent finishing of stainless steel? Pearlescent finishing of stainless steel is highly compatible with plating.
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
Can be used with a household 100V power supply! Compact size and space-saving.
Achieve an even finish without polishing marks through "planetary motion" with a rotary 4-axis buff!
Complete automation of the grinding and polishing process! Reducing human errors and ensuring very high reproducibility.
A dedicated belt grinder designed for incorporation into robots and devices. It has the highest output in the lineup, suitable for heavy grinding of castings and welded parts.
Maximum output 20A, body weight 6.7kg! Compact type electrolytic device.
IPA steam cleaning and drying equipment! Achieving clean drying for devices, wafers, glass, and parts!
An automatic polishing machine specialized for "reproducibility"! It is a single unit that also excels in maintainability.
Installation of an inverter is also possible! A buffing machine suitable for bench work with a low spindle center height.
Introducing a diverse lineup of polishing machines, including polishers and buffers!
Consistent support from sales proposals to design, manufacturing, and delivery! Transforming production through tool regrinding.
Capable of handling various grinding tasks! It produces minimal dust dispersion and provides a quiet working environment.
Non-stop roller conveyance! Accelerating the automation and inline processing of thin material burr removal with bottom grinding that doesn't require inversion!
Just gently insert the work! We will fulfill your wish to easily polish it.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
Carburizing hardening and polishing processing using steel materials! Capable of buff polishing with excellent surface roughness.
Introducing an automatic polishing machine with a total weight of 77kg, available with an optional splash kit and lid!
T-DRILL method allows processing of branch pipes (perforation, drawing, end face processing) with one machine! Reduces outsourcing costs and shortens work time. *Exhibited at the Welding Show.
No special tools are required! The three processes of drilling, pulling, and end face machining can be easily performed with one machine.
Achieving high-quality polishing that preserves the edge through mechanization.
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
For processing complex shapes. Are you having trouble with regrinding small diameter end mills?
A simple and efficient grinder! Easy maintenance with removable parts, etc.
Ideal for post-CMP cleaning of wafers! Achieves high cleanliness with special cleaning.
A precision tabletop grinding machine that accommodates sample mounting, surface preparation, coarse grinding, and finishing grinding! It enables accurate grinding of samples that require high surface precision!
We provide reliable support from the sale of internal and external mold materials to processing.
Collection of Major Component Processing Case Studies - Free Gift
Standard with two axes for the grinding wheel shaft! Additional installation is possible to meet needs.
Low wear on the whetstone for long-lasting use! Water-cooled circulation automatic sharpening machine that suppresses blade overheating.
High reliability, large capacity, precise and efficient surface grinding equipment.
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
You can quickly find the perfect polishing tool for your needs and preferences!
A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
Original polishing material "SS Wheel," a versatile and easy-to-use standard type polishing wheel.
High-precision polishing of freeform surface shapes! Processing technology for finishing and surface shape correction of high-precision optical components.
It is possible to perform uniform UV irradiation over the entire area of the wafer by rotating the work while irradiating.
PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).
Vibration is not transmitted to the hand, and safety is further enhanced with high efficiency from circuit optimization and heat protection features!
It is possible to create various works that match the user's specifications from the development stage.
Can be mounted on a standard lathe! Recommended for grinding, polishing, and finishing small parts.
Supports regrinding of small-diameter end mills essential for high-precision molds.
The sample is a mold for forging super hard alloys! Internal polishing is done through fluid polishing and hand polishing.
Automatic device for reducing warpage of thin wafers after back grinding, capable of outer circumference cutting after tape application.
Jewelry and dental tabletop (small) electro-polishing device
A simple and effective hand tool to enhance the flexibility of FANUC collaborative robots CRX!
Robust welding structure! It can maintain high-speed and stable operation even during long hours of continuous operation.
【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
Solving the issues of dicing! Contributing to productivity improvement through advanced process technology.
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
Achieve speed! A compact automatic belt sander with stable finishing.
A lineup of lens polishing machines that can accommodate various optical surfaces and interferometers that can measure flat shapes without being affected by the back surface.
We are currently offering a comprehensive catalog of grinding machines, polishing machines, and dust collectors! It includes dust collectors that compactly house buffing machines and cyclones with filters inside the unit!
Easy to operate for anyone! A compact, space-saving centerless grinding machine.
Making the manufacturing of electronic components smoother with innovative technology that connects to the world.
It is possible to handle a wide range from processing that requires high grinding power to gloss and mirror finishing!
Most of the work is done in-house through trial and error! We handle all processes including design, manufacturing, machining, welding, electrolysis, and cleaning internally.
A versatile system-type polishing machine that can be widely used!
A polishing and grinding system based on diverse and highly reliable technologies that pursues the production of high-quality samples.
Efficiently polishing large samples or a large quantity of samples in a short time.
Devices can be selected according to the size of the processed items! Features, dimensions, and the number of carriers are also included!
Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!
A basic model of a side grinding machine that achieves high efficiency with high precision and high-level operability!
Significantly reduce the processing time for 1 cycle (1 blade soldering)! Equipped with a nylon brush rotating cleaning unit.
Due to the wet oscillation type, the polishing surface is exceptionally excellent!
We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.
[Made in Japan] Precision Grinding Tape Used
Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.
Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.
I'm graduating from hand polishing!
A dedicated belt grinder designed for incorporation into robots and devices. Suitable for fine deburring, chamfering, and finishing.
We can provide consistent production from substrate arrangement to mask design! Introducing the contract processing services of Global Net Co., Ltd., including pattern wafer services!
"Melting and joining" achieves high-difficulty, high-quality laser welding. Yasouka's welding technology is also utilized in the medical and food industries.
This is a filter that uses ceramic (alumina) spheres. Since spherical shapes are used, the filtration accuracy is uniform.
It falls smoothly even with a slight slope! Measures against clogging, bridging, residue, and foreign matter contamination.
Achieving a mirror finish on the inner surface of flexible tubes used in semiconductor manufacturing equipment! Ultra-precision special mirror polishing technology services and design and production of automated manufacturing equipment.