Eagle AERO is a high-throughput wire bonding device.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
Achieving stable tension force using a unique ceramic nozzle.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
Flexibly respond to the manufacturer's discontinuation of bonding products.
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
Achieving high-quality bonds optimized for automotive powertrains.
Providing optimal and high-quality bonding that supports multi-pin configurations.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
Manual flip chip bonder suitable for small-scale production and various experiments.
Full auto ACF implementation line, ideal for camera modules and more.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
Easy operation! Results such as wire trajectories are displayed visually!
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
High-performance flip chip bonder for multi-variety cell production lines.
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Supports high-precision stacked packages such as NAND flash.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004
Flexible bonding function! With Y and Z motor drive, it offers easy operability.
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
ASMPT is a backend equipment manufacturer based in Singapore.
A controllable current transducer and frequency that continuously monitors wire deformation.
Providing optimal and high-quality bonds that support high-speed transmission.
Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.
Providing optimal adhesive for large-capacity bonding for EV batteries.
Easily connect copper wire chips with innovative laser heating.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
Continuous thermal bonding with multi-heads and efficient handling with carrier transport.
Continuous thermal bonding with a multi-head system achieves a stable temperature profile.
Three times the brightness. Achieving both compactness and high luminosity!
A method to triple production capacity without expanding the clean room!
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.