A controllable current transducer and frequency that continuously monitors wire deformation.
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Supports high-precision stacked packages such as NAND flash.
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
We offer a diverse lineup including bonding press machines and laminating machines!
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
Full auto ACF implementation line, ideal for camera modules and more.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
Manual flip chip bonder suitable for small-scale production and various experiments.
Easy operation! Results such as wire trajectories are displayed visually!
Three times the brightness. Achieving both compactness and high luminosity!
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as well as in the fields of biotechnology and medicine.
This is the world's first product to generate atmospheric pressure plasma on a surface.
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
Ideal for bonding small pin ICs such as QFN.
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
Ideal for bonding small pin ICs such as QFN.
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
Achieving stable dispensing of two-component adhesive!
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
Real-time monitoring system for semiconductor packaging process anomalies
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004
FC/COG/COF Bonder Market Analysis Report 2005
Analysis of the LCD Implementation Device Market and Demand Trends for LCD Driver ICs
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
Precision parts processing / stainless steel processing / SUS processed products
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
The M17 series is capable of providing flexible and highly reliable solutions for various bonding challenges.
Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.
For fine lines and thick lines! Easy operability based on ergonomic mobile user panels.
Flexibly respond to the manufacturer's discontinuation of bonding products.
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
Eagle AERO is a high-throughput wire bonding device.
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
ASMPT is a backend equipment manufacturer based in Singapore.
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.
You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!