A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
Wide work area! Built-in non-destructive testing pull test function for wires and ribbons.
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
Ideal for bonding small pin ICs such as QFN.
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
A device that performs a series of processes from slit coating to vacuum lamination.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
This is the world's first product to generate atmospheric pressure plasma on a surface.
Supports high-precision stacked packages such as NAND flash.
Ideal for bonding small pin ICs such as QFN.
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.
You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!
Bonding position accuracy of 0.5µm!
High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.
Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.
Full auto ACF implementation line, ideal for camera modules and more.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
Continuous thermal bonding with multi-heads and efficient handling with carrier transport.
Continuous thermal bonding with a multi-head system achieves a stable temperature profile.
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
A controllable current transducer and frequency that continuously monitors wire deformation.
Adoption of a central control system! Automatic calibration updates.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
Three times the brightness. Achieving both compactness and high luminosity!
Easy operation! Results such as wire trajectories are displayed visually!
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as well as in the fields of biotechnology and medicine.
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
Achieving stable tension force using a unique ceramic nozzle.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
Achieving stable dispensing of two-component adhesive!
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
High-performance flip chip bonder for multi-variety cell production lines.
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
FC/COG/COF Bonder Market Analysis Report 2005
