Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Ideal for bonding small pin ICs such as QFN.
Ideal for bonding small pin ICs such as QFN.
Achieving stable tension force using a unique ceramic nozzle.
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
A controllable current transducer and frequency that continuously monitors wire deformation.
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Supports high-precision stacked packages such as NAND flash.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
High-performance flip chip bonder for multi-variety cell production lines.
From research and development to production! We demonstrate high quality and high versatility.
For fine lines and thick lines! Easy operability based on ergonomic mobile user panels.
Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
ASMPT is a backend equipment manufacturer based in Singapore.
A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
Full auto ACF implementation line, ideal for camera modules and more.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
Manual flip chip bonder suitable for small-scale production and various experiments.
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
Easy operation! Results such as wire trajectories are displayed visually!
Three times the brightness. Achieving both compactness and high luminosity!
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as well as in the fields of biotechnology and medicine.
This is the world's first product to generate atmospheric pressure plasma on a surface.
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
Achieving stable dispensing of two-component adhesive!
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
