Ideal for bonding small pin ICs such as QFN.
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
A controllable current transducer and frequency that continuously monitors wire deformation.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
Supports high-precision stacked packages such as NAND flash.
Achieving stable tension force using a unique ceramic nozzle.
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
Real-time monitoring system for semiconductor packaging process anomalies
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
Full auto ACF implementation line, ideal for camera modules and more.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
Adoption of a central control system! Automatic calibration updates.
Wide work area! Built-in non-destructive testing pull test function for wires and ribbons.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as well as in the fields of biotechnology and medicine.
This is the world's first product to generate atmospheric pressure plasma on a surface.
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
Ideal for bonding small pin ICs such as QFN.
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
High-performance flip chip bonder for multi-variety cell production lines.
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004