Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
Expansion of productivity! The large work area allows for batch processing of multiple devices.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as well as in the fields of biotechnology and medicine.
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
A controllable current transducer and frequency that continuously monitors wire deformation.
Three times the brightness. Achieving both compactness and high luminosity!
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
Supports high-precision stacked packages such as NAND flash.
Achieving stable tension force using a unique ceramic nozzle.
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
ASMPT is a backend equipment manufacturer based in Singapore.
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
Full auto ACF implementation line, ideal for camera modules and more.
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
Adoption of a central control system! Automatic calibration updates.
Wide work area! Built-in non-destructive testing pull test function for wires and ribbons.
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
Manual flip chip bonder suitable for small-scale production and various experiments.
Easy operation! Results such as wire trajectories are displayed visually!
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
This is the world's first product to generate atmospheric pressure plasma on a surface.
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
Ideal for bonding small pin ICs such as QFN.
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
Ideal for bonding small pin ICs such as QFN.
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
Achieving stable dispensing of two-component adhesive!
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
High-performance flip chip bonder for multi-variety cell production lines.
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
The M17 series is capable of providing flexible and highly reliable solutions for various bonding challenges.
Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.
For fine lines and thick lines! Easy operability based on ergonomic mobile user panels.
Flexibly respond to the manufacturer's discontinuation of bonding products.
We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company's needs.
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.