A next-generation semiconductor substrate flattening processing device that achieves both cost reduction and high quality for power semiconductor substrates! Realizing high-precision flattening processing while minimizing environmental impact.
2018 edition of the NFPA-approved Japanese version materials. A sample version including up to Chapter 3 is available for free.
Achieving a filtration precision of 1μm! Filtration of brittle materials such as quartz glass and ceramics using a patented backwashing system! Technical documentation is also available!
Multi-layer film formation enables the improvement of load-bearing capacity for low-temperature DLC (Diamond-like carbon) thin film hard coatings!
Numerous adoption results worldwide. We propose suitable solutions for automatic plating solution analysis in various electroplating and electroless plating processes, as well as in the Cu damascene process.
High-quality and diverse substrate transport tools.
A must-see for those who find mold costs a bottleneck in battery case production! Flexible design shapes are possible with reliability equivalent to stamping processes. Numerous achievements in the aerospace industry.
It is possible to perform uniform UV irradiation over the entire area of the wafer by rotating the work while irradiating.
Vietnam is no longer just a cheap country.
Supporting quality improvement through comprehensive maintenance of electric dust collectors.
Supporting stable operation of electrical equipment through comprehensive maintenance of electric dust collectors.





























![0_logo[1].jpg](https://image.mono.ipros.com/public/company/image/c4c/2006029/IPROS71427954949837207986.jpeg?w=280&h=280)











































































































