If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
Numerous adoption results worldwide. We propose suitable solutions for automatic plating solution analysis in various electroplating and electroless plating processes, as well as in the Cu damascene process.
A clear explanation of case studies related to semiconductor testing, divided into four sections: background, issues, implementation, and results!
Goodbye, dents. By replacing spot welding with fiber laser welding, it is possible to achieve such beautiful welds that finishing of dents is unnecessary!
We can repair over 150 semiconductor manufacturing equipment manufacturers! We offer flexible responses regarding delivery times and quality assurance.
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
High-quality and diverse substrate transport tools.
Vietnam is no longer just a cheap country.
It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!
We can provide heat-resistant IC chip trays made of SUS (stainless steel).
Metal seal for canisters. Good news for substances that cannot use resin or elastomer seal materials! By adopting metal seals, helium leak tightness has been achieved.
Free gift! A booklet covering troubles that occur in semiconductor manufacturing equipment and basic knowledge.








































































































































