Achieving a filtration precision of 1μm! Filtration of brittle materials such as quartz glass and ceramics using a patented backwashing system! Technical documentation is also available!
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!
We manufacture carriers according to customer needs for use as wafer holders in the lapping and polishing process of silicon wafer manufacturing.
It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!
Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).
2018 edition of the NFPA-approved Japanese version materials. A sample version including up to Chapter 3 is available for free.
Goodbye, dents. By replacing spot welding with fiber laser welding, it is possible to achieve such beautiful welds that finishing of dents is unnecessary!
High-quality and diverse substrate transport tools.











































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