2018 edition of the NFPA-approved Japanese version materials. A sample version including up to Chapter 3 is available for free.
A semiconductor collet with faster defect detection, higher visibility, and consideration for scratches on the chip.
Using a UV-LED with a wavelength of 365nm, at room temperature irradiation, with low running costs!
Metal seal for canisters. Good news for substances that cannot use resin or elastomer seal materials! By adopting metal seals, helium leak tightness has been achieved.
Just by attaching a light sensor to the patrol lamp, you can monitor operation! It can transmit and receive even at a distance of about 10 km.
A must-see for those who find mold costs a bottleneck in battery case production! Flexible design shapes are possible with reliability equivalent to stamping processes. Numerous achievements in the aerospace industry.
A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!
A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!
It is a cleaning device widely used for flux cleaning of electronic substrates and electronic components!




































































































































![0_logo[1].jpg](https://image.mono.ipros.com/public/company/image/c4c/2006029/IPROS71427954949837207986.jpeg?w=280&h=280)






