It enables the manufacturing of power modules with a Tjmax of over 200℃, contributing to improved reliability of chip bonding and overall cost reduction.
It is possible to evaluate degassing in an environment close to the actual process by bringing the materials into contact with each other.
Recycled tin ingots [supporting low purity 96% to high purity 99.999%]
Introducing KEIY Electronics' "Quality Assurance"! Shipping inspections that don't miss a single detail.
Presenting technical information: Explanation of the principle of solder bonding to the surface of the circuit board.
OEM/ODM compatible, flat edge net, dedicated wire net! Wall-mounted hook
OEM/ODM support, processing and contracting of curtain rails.
OEM/ODM compatible! We produce snow rakes, garden cleaners, and more!
Excellent heat and corrosion resistance, suitable for complex shapes such as heat exchangers! A paste solder material suitable for various coating devices with high stability that suppresses separation and alteration. [Catalog available]
Reduction of solder balls and stabilization of solder levels! A case that solved the issue of requiring some modifications to match the target products.
Reduce the incidence of HIP and NWO defects! Features of low melting point solder paste are included.
Introducing examples of achieving energy savings and cost reduction with solder paste! Contributing to carbon neutrality through CO2 reduction! Impact resistance equivalent to SAC305!











































































































