Repair and reconfiguration of display devices with unknown manufacturers or maintenance providers (very welcome).
Compact packaging of semiconductor wafers. Thin wafers can also be transported safely. Complies with ANSI/ESD S541 standards.
We offer SiC wafers at low cost starting from just one piece! Delivery time is as short as two weeks. We can provide low-priced, small quantities for the development and prototyping of power semiconductors.
Safely and cleanly transporting wafers, the foundation of semiconductor technology!
Cases for storage and transportation of various substrates such as silicon wafers, sapphire wafers, SiC wafers, and glass substrates.
[Factory Security] No software installation required
Prevention of damage from shock and vibration!!
We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
From prototype to mass production! We accept plating for various types of wafers!
Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!
In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
We will come to collect at the specified location! Please consult us regarding the quantity and shape.
We have a variety of silicon ingots in different diameters available.
We have a selection of small-diameter (approximately φ300) silicon ingots available.
If it is machining, it can be produced without a mold.
Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
We deliver high-purity products for both sputtering targets and deposition materials.
High-quality, low-cost single crystal SiC wafers ★ Available from just one piece ♪
China-made GaAs single crystal GaAs wafers high purity GaAs poly
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
We will coat with fluororesin that has the properties of being heat-resistant, chemical-resistant, non-conductive, non-stick, and slippery.
A business that considers the global environment based on consumer trends! Emphasizing planning, development, and proposal capabilities!
Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!
Available in 200mm and 300mm! Please consult us regarding the types of films available according to your preferences.
Bernoulli chuck capable of efficient non-contact transport even for heavy workloads.
Curing applications for wafer dicing tape, featuring stable long lifespan with UV-LED adoption.
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
Compactly designed tabletop UV (ultraviolet) ozone cleaning and modification device 'CUVD Series' for the removal of organic contaminants from silicone wafers, semiconductor components, and more.
2 inches; 3 inches; 4 inches; 5 inches; 6 inches; 8 inches; 12 inches. Dummy wafers available for each grade up to prime wafers.
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
Ultra-thin high-precision processing of W tungsten and its alloys.
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
We have a wide stock of silicon wafers ranging from 2 inches to 12 inches in various types, and we can provide small lots, short delivery times, and stable supply!
We can provide small lots, short delivery times, and stable supply! We offer a wide variety of silicon wafers for semiconductors.
Introducing semiconductor-grade polysilicon such as 11N polysilicon and 6N polysilicon!
Support for small lots is also available! A wide lineup of epitaxial wafers.
Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!
We offer a range of particle management products in various sizes. We can provide them according to your specifications and requirements.
We handle various types of membrane-coated wafers. We also accept inquiries regarding specially processed wafers.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
After cleaning on a dedicated line, it is shipped in a clean pack, making it easy to use without any hassle! A wafer transport case that also helps reduce costs!
Automating and streamlining the supply of sealing tapes and small, difficult-to-transport materials like reinforcement plates for semiconductor device manufacturing before the reflow process!
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.
It is a tape that does not have to worry about paper dust from paper rolls, even when brought into a clean room.
Achieve uniform development processing with a unique spray array! Introducing a development device with excellent maintenance characteristics.
3D implementation services (implementation services using TSV technology, etc.)
We manufacture and provide contract processing from high-purity polycrystalline silicon, which is the raw material for single crystals, to the device front-end process.
It is a device for vacuum thermal pressing into 3D shapes. It can adhere to curved surfaces, seal uneven surfaces, and follow steps.
This is a device that can contribute to reducing environmental impact.
Manufacturing of parts made of copper, brass, aluminum, and stainless steel related to electronic components and semiconductor-related components.
Our company offers products made from various materials to our customers.
Please contact us. We will search for it in our network.
Customize wafers according to your needs! We respond to your requests with a full lineup of sizes.
Dramatically increase the cleaning power of ultrasonic cleaning!
Micron diamond powder, industrial diamond powder