Adopts motor drive! Dust-free and suitable for clean rooms.
Prevention of damage from shock and vibration!!
Best cost performance! Shortest delivery time! A six-sided appearance inspection machine for chip-type multilayer ceramic capacitors utilizing artificial intelligence (AI).
[Factory Security] No software installation required
It is a surface resistance value of less than 1×12Ω!
Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
Bubbles-free application possible! Non-contact type for patterned surfaces can also be produced.
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
We have a variety of silicon ingots in different diameters available.
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
The sale of the appearance inspection device "AURCA series," which supports RDL defect inspection, bump defect inspection, and TSV defect inspection, has begun!
Achieving a size and low price that large companies cannot offer. With a compact design that is easy to introduce into laboratories, customization to specifications that match wafers and special substrates is also flexible.
Safely and cleanly transporting wafers, the foundation of semiconductor technology!
◆Surface roughness Ra1nm or less◆
Anyone can easily measure pressure and load values instantly and visualize them immediately!
We will come to collect at the specified location! Please consult us regarding the quantity and shape.
We have a wide stock of silicon wafers ranging from 2 inches to 12 inches in various types, and we can provide small lots, short delivery times, and stable supply!
Increased curing treatment efficiency with UV irradiation in a vacuum environment! Supports wafering up to a maximum of 8 inches! Demonstrations and customization available!
It is made in Thailand with large-scale hydropower. Please consider it as a source to reduce reliance on China.
We provide silicon wafers that meet your requirements with short delivery times and low prices! Same-day shipping available.
We will coat with fluororesin that has the properties of being heat-resistant, chemical-resistant, non-conductive, non-stick, and slippery.
We will custom manufacture all-Teflon cleaning fixtures for cleaning substrates and other items!
We can accommodate small quantities from 3 inches to 12 inches. Depending on the specifications, SOI wafers with high resistance substrates and high resistance active layers are also available!
We can introduce SOS wafers (silicon-on-sapphire wafers) with diameters of 3 inches, 4 inches, and 6 inches.
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.
This is a device that can contribute to reducing environmental impact.
Manufacturing of parts made of copper, brass, aluminum, and stainless steel related to electronic components and semiconductor-related components.
3D implementation services (implementation services using TSV technology, etc.)
Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
Ultra-thin high-precision processing of W tungsten and its alloys.
Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!
We offer a range of particle management products in various sizes. We can provide them according to your specifications and requirements.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
Analytical methods essential for the processes and quality control in semiconductor manufacturing.
We will obtain high-quality silicon from the market very efficiently and provide it to you!
Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!
For low-cost, high-performance wet processing equipment, please leave it to us.
Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).
Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case
Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.
Customize wafers according to your needs! We respond to your requests with a full lineup of sizes.
Ensure semiconductor cost negotiations and support automotive development.
Recruiting participants for the CMC seminar to be held in Singapore on October 28, 2026!
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
Simultaneous measurement of inorganic and organic components in minute specific areas.
Shape observation and simple quantitative analysis using SEM-EDX.
Examples of applications used in a wide range of areas such as graph creation, matrix calculations, and numerical solutions of simultaneous differential equations.
Cases for storage and transportation of various substrates such as silicon wafers, sapphire wafers, SiC wafers, and glass substrates.
China-made GaAs single crystal GaAs wafers high purity GaAs poly
We offer single crystal lithium niobate (LN / LiNbO3) ingots, wafers, and special processing.
Injection into various products from semiconductors to medical applications is possible! Suitable for Si, SiC, GaN, etc.!
Murakami's screen mask options boast industry-leading variety and applicability.
Low cost and high productivity! With modular design, the equipment can be configured to meet customer requirements.
Publication of the regional distribution, production capacity, and supply-demand analysis of chip factories around the world.
Superior lubrication and cooling performance, high grinding efficiency, excellent surface treatment quality, better finishing, easy to use.
If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
It has the characteristic of small output fluctuations due to temperature, making it possible to expand into various fields! Custom manufacturing is also available.
Utilizing a rich network for material and supply procurement from research and development to mass production!
A wide range of products including ingots and 4-inch, 6-inch, and 8-inch wafers! Leave the procurement of high-quality, low-cost SiC wafers to us.
Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
For stock sales of 4-inch 4H-N SiC wafers, contact Orbilink | Manufactured by TanKeBlue, dual-sided CMP, available for immediate delivery.
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
[Sample Presentation] For metal-free applications of chemical agents in the manufacturing processes of electronic materials such as semiconductors and liquid crystals.
Fine glass cutting processing, glass cutting processing
We offer 6-inch SiC substrate wafers, 6-inch GaN-on-Si HEMT RF epitaxial wafers, and more.
The transportation between UV and heating treatment by the operator has been simplified into a single device, making it a safe specification that can be used with peace of mind.
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.
Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.
Film deposition is possible on wafers ranging from 2 inches to 12 inches.
We can accommodate small lots. We will do our best to handle special epoxies and multi-layer epoxies as well.
We can provide sizes from under 1 inch to 450 mm. We also support various film processing, as well as FZ wafers, sapphire, germanium, and compound semiconductors.
![opt_epi_02[1].jpg](https://image.mono.ipros.com/public/product/image/52e/2000521844/IPROS94179912388727544119.jpeg?w=280&h=280)
Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.
Support for materials testing in the aerospace field.
The world's first cooling water composite treatment agent formulated with "non-chlorine inorganic sterilizing components" developed through Organo's unique manufacturing technology.
Products from Micromanipulator, a U.S. company that has been developing and manufacturing probing-related products for semiconductor device analysis for over 60 years.
We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.
High-quality bumping service provided by our independently developed screen printing machine!
Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.
We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.
Compatible with 300mm wafers! Successfully created patterns at widths close to the target sizes of recent devices.
Compact packaging of semiconductor wafers. Thin wafers can also be transported safely. Complies with ANSI/ESD S541 standards.
[Demo unit available for loan] This lighting is suitable for inspecting transparent and translucent compound semiconductor wafers, defect inspection on non-transparent silicon wafer surfaces, and scratch inspection on optical lenses.
The heating section is always a constant nozzle heater and planar heater.
In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components!
Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.