Repair and reconfiguration of display devices with unknown manufacturers or maintenance providers (very welcome).
We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
[Factory Security] No software installation required
China-made GaAs single crystal GaAs wafers high purity GaAs poly
Compact packaging of semiconductor wafers. Thin wafers can also be transported safely. Complies with ANSI/ESD S541 standards.
Prevention of damage from shock and vibration!!
Film deposition is possible on wafers ranging from 2 inches to 12 inches.
In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components!
It can grasp and transfer fragile films and ultra-thin sheets non-contact.
Prototype support, small quantity support, 4 to 8 inch support, customizable thickness and shape, PCB arrangement possible, support for supplied PCBs, short delivery time.
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
Introducing semiconductor-grade polysilicon such as 11N polysilicon and 6N polysilicon!
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
Our company offers products made from various materials to our customers.
This is a device that can contribute to reducing environmental impact.
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
After cleaning on a dedicated line, it is shipped in a clean pack, making it easy to use without any hassle! A wafer transport case that also helps reduce costs!
Cases for storage and transportation of various substrates such as silicon wafers, sapphire wafers, SiC wafers, and glass substrates.
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
We have a track record of supplying major semiconductor manufacturers in Japan, South Korea, and China. We provide our products with high-level foreign matter management.
Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.
We will custom manufacture all-Teflon cleaning fixtures for cleaning substrates and other items!
![opt_epi_02[1].jpg](https://image.mono.ipros.com/public/product/image/52e/2000521844/IPROS94179912388727544119.jpeg?w=280&h=280)
Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.
We can accommodate small lots. We will do our best to handle special epoxies and multi-layer epoxies as well.
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
◆Surface roughness Ra1nm or less◆
We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.
We will propose and manufacture test wafers for film formation processes tailored to the circumstances of each company.
Available in 200mm and 300mm! Please consult us regarding the types of films available according to your preferences.
Recommended for research purposes! Patterned wafer with HDP as the top layer.
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
[Demo unit available for loan] This lighting is suitable for inspecting transparent and translucent compound semiconductor wafers, defect inspection on non-transparent silicon wafer surfaces, and scratch inspection on optical lenses.
In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
Polishing processes are available in various sizes and thicknesses.
Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!
Anyone can easily measure pressure and load values instantly and visualize them immediately!
A wafer that can easily and reliably collect microscopic foreign substances in contact with the back surface.
We offer 6-inch SiC substrate wafers, 6-inch GaN-on-Si HEMT RF epitaxial wafers, and more.
Introducing a device that supports 6.8-inch SEMI standard wafers and allows for the selection of basic transfer patterns!
Leave it to us for various oxide single crystals for the IT field centered around mobile communications.
We will accommodate various stud bump processing according to your specifications.
Nihon Kinoshita Materials Co., Ltd. provides epitaxial growth films of SiGe.
2 inches; 3 inches; 4 inches; 5 inches; 6 inches; 8 inches; 12 inches. Dummy wafers available for each grade up to prime wafers.
Ultra-thin high-precision processing of W tungsten and its alloys.
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
We will come to collect at the specified location! Please consult us regarding the quantity and shape.
We have a wide stock of silicon wafers ranging from 2 inches to 12 inches in various types, and we can provide small lots, short delivery times, and stable supply!
We can provide small lots, short delivery times, and stable supply! We offer a wide variety of silicon wafers for semiconductors.
We have a variety of silicon ingots in different diameters available.
Support for small lots is also available! A wide lineup of epitaxial wafers.
Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!
We have a selection of small-diameter (approximately φ300) silicon ingots available.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
If it is machining, it can be produced without a mold.
Please contact us. We will search for it in our network.
Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
Successfully conducted experiments aboard the NASA Space Shuttle!
It is a device for vacuum thermal pressing into 3D shapes. It can adhere to curved surfaces, seal uneven surfaces, and follow steps.
Quantification of anions in high-concentration sodium hydroxide solution for semiconductor manufacturing using ion chromatography.
Automating quality control of the chloride ion concentration in the acidic copper plating bath used for Cu deposition on semiconductor wafers using a potentiometric automatic titration system.
Simultaneous analysis of ammonium hydroxide, hydrogen peroxide, and hydrochloric acid in the wafer cleaning tank monitored by inline near-infrared analyzer!
Process analyzer / Online analyzer for continuous monitoring of hydrogen peroxide concentration in the CMT process!
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
Analytical methods essential for the processes and quality control in semiconductor manufacturing.
We will obtain high-quality silicon from the market very efficiently and provide it to you!
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
Analysis of the semiconductor equipment market covering wafer fabrication equipment (WFE), testing, packaging, and assembly equipment.
Aluminum filler with high thermal conductivity and heat dissipation properties.
Faithfully reproducing the products that customers want to create. Responding to the diverse needs of the electronics industry.
Achieve uniform development processing with a unique spray array! Introducing a development device with excellent maintenance characteristics.
3D implementation services (implementation services using TSV technology, etc.)
We manufacture and provide contract processing from high-purity polycrystalline silicon, which is the raw material for single crystals, to the device front-end process.
Manufacturing of parts made of copper, brass, aluminum, and stainless steel related to electronic components and semiconductor-related components.
Customize wafers according to your needs! We respond to your requests with a full lineup of sizes.
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
Safely and cleanly transporting wafers, the foundation of semiconductor technology!
Dramatically increase the cleaning power of ultrasonic cleaning!
This is a single crystal sapphire wafer widely used for LED and optical parts.
We deliver high-purity products for both sputtering targets and deposition materials.
Micron diamond powder, industrial diamond powder
Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car flows. Compared to conventional methods, it has a smaller footprint.
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car floss. Compared to conventional methods, it reduces the footprint.
We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!