If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
[Factory Security] No software installation required
Aluminum is a top performer in recycling! Additionally, its lightweight nature contributes to reduced transportation costs and less burden on workers!
Prevention of damage from shock and vibration!!
Plastic containers (Placon) that can be used in clean rooms - can be produced in small quantities.
Fast, easy, and user-friendly! A dicing sheet applicator compatible with all standard tapes.
Repair and reconfiguration of display devices with unknown manufacturers or maintenance providers (very welcome).
We will come to collect at the specified location! Please consult us regarding the quantity and shape.
Compact packaging of semiconductor wafers. Thin wafers can also be transported safely. Complies with ANSI/ESD S541 standards.
Compactly designed tabletop UV (ultraviolet) ozone cleaning and modification device 'CUVD Series' for the removal of organic contaminants from silicone wafers, semiconductor components, and more.
Safely and cleanly transporting wafers, the foundation of semiconductor technology!
◆Surface roughness Ra1nm or less◆
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
Film deposition is possible on wafers ranging from 2 inches to 12 inches.
Semiconductor power devices can be widely used in various industrial fields, including consumer electronics.
In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components!
We offer silicon wafers such as particle management wafers and dummy mirror wafers!
Prototype support, small quantity support, 4 to 8 inch support, customizable thickness and shape, PCB arrangement possible, support for supplied PCBs, short delivery time.
Prototype support, small quantity support, 4 to 12 inch support, optional film thickness (10nm to 20μm), substrate arrangement possible, support for supplied substrates, short delivery time.
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
Simultaneous analysis of ammonium hydroxide, hydrogen peroxide, and hydrochloric acid in the wafer cleaning tank monitored by inline near-infrared analyzer!
Process analyzer / Online analyzer for continuous monitoring of hydrogen peroxide concentration in the CMT process!
We manufacture and provide contract processing from high-purity polycrystalline silicon, which is the raw material for single crystals, to the device front-end process.
It is a device for vacuum thermal pressing into 3D shapes. It can adhere to curved surfaces, seal uneven surfaces, and follow steps.
Please contact us. We will search for it in our network.
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
We have a wide stock of silicon wafers ranging from 2 inches to 12 inches in various types, and we can provide small lots, short delivery times, and stable supply!
We have a variety of silicon ingots in different diameters available.
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
Cases for storage and transportation of various substrates such as silicon wafers, sapphire wafers, SiC wafers, and glass substrates.
Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!
There is a track record of growing nitride semiconductor crystals on various semiconductor substrates. Customization is also possible according to your requests.
12-inch wafer processing with ring attachment is possible! Surface modification, removal of inorganic/organic contamination! Ideal for evaluation and research before mass production! High speed, low cost.
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
Proposal for semiconductor manufacturing: We offer cost-effective materials as alternatives to traditional thick epitaxy and inverted epitaxy for IC and MEMS applications.
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
[Sample Presentation] For metal-free applications of chemical agents in the manufacturing processes of electronic materials such as semiconductors and liquid crystals.
A wafer that can easily and reliably collect microscopic foreign substances in contact with the back surface.
Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.
We will custom manufacture all-Teflon cleaning fixtures for cleaning substrates and other items!
We will manufacture custom jigs to accommodate various wafer sizes (2" to 12") or specifications! We can also provide a variety of materials!!
A system that makes it possible to evaluate coatings in the aerospace field all with one machine.
A system for measuring cell characteristics at the nanoscale.
Coating tests that support the miniaturization and high functionality of semiconductor devices.
We can accommodate small lots. We will do our best to handle special epoxies and multi-layer epoxies as well.
We can accommodate small quantities from 3 inches to 12 inches. Depending on the specifications, SOI wafers with high resistance substrates and high resistance active layers are also available!
![opt_epi_02[1].jpg](https://image.mono.ipros.com/public/product/image/52e/2000521844/IPROS94179912388727544119.jpeg?w=280&h=280)
Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.
Adopts motor drive! Dust-free and suitable for clean rooms.
We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.
We will propose and manufacture test wafers for film formation processes tailored to the circumstances of each company.
The image is an example of a Cu blanket wafer!
Very useful for CMP research and development applications! Patterns with high step heights are also available.
Available in 200mm and 300mm! Please consult us regarding the types of films available according to your preferences.
A pattern wafer manufactured in domestic mass production, close to device grade.
Products from Micromanipulator, a U.S. company that has been developing and manufacturing probing-related products for semiconductor device analysis for over 60 years.
The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.
For matters related to steel, recycled materials, electronic materials, and semiconductor manufacturing equipment, please contact us.
Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
Responsible for the manufacturing and processing of quartz products with a safe and functional production system.
We provide wafers with a consistent production line and new equipment, from crystal raw materials to wafers!
Anyone can easily measure pressure and load values instantly and visualize them immediately!
Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
A consistent production system that includes wafer testing and final inspection.
Nihon Kinoshita Materials Co., Ltd. provides epitaxial growth films of SiGe.
Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
From prototype to mass production! We accept plating for various types of wafers!
"894 Professional CVS Analyzer" capable of multi-sample continuous automatic analysis by combining a sample changer and an electric burette.
Quantification of anions in high-concentration sodium hydroxide solution for semiconductor manufacturing using ion chromatography.
Automating quality control of the chloride ion concentration in the acidic copper plating bath used for Cu deposition on semiconductor wafers using a potentiometric automatic titration system.
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
Analytical methods essential for the processes and quality control in semiconductor manufacturing.
2 inches; 3 inches; 4 inches; 5 inches; 6 inches; 8 inches; 12 inches. Dummy wafers available for each grade up to prime wafers.
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
Ultra-thin high-precision processing of W tungsten and its alloys.
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
Achieve uniform development processing with a unique spray array! Introducing a development device with excellent maintenance characteristics.
3D implementation services (implementation services using TSV technology, etc.)
This is a device that can contribute to reducing environmental impact.
Our company offers products made from various materials to our customers.