
We are committed to high-quality manufacturing and a 100% on-time delivery rate.

High-temperature ion implantation suitable for the fabrication of devices such as SiC, as well as high-temperature annealing processes for dopant activation, are available!

ROHS2 compliant, stable quality with precise solder feeding, and cost reduction!

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

We provide consistent support from design to final product release! *We have a track record of adoption for the supercomputer "K".

We are currently offering a free electronic circuit board design handbook that achieves cost reduction and quality improvement for substrates!

Substrate mounting [SMT (Surface Mount Technology)] can accommodate chip sizes from 0402 and substrate sizes from 30×50mm! Both leaded and lead-free options are available.