Avoiding the crisis of production interruption! Achieving rapid and reliable EOL response through replacement design and reverse engineering.
High-temperature ion implantation suitable for the fabrication of devices such as SiC, as well as high-temperature annealing processes for dopant activation, are available!
We propose a one-of-a-kind product tailored to our customers' needs with original ideas. *Company brochure available.
Complete mechanical and electrical solutions in one place. Leave everything from mechatronics, equipment, control panels, to parts procurement and adjustments to us.
ROHS2 compliant, stable quality with precise solder feeding, and cost reduction!
We always meet our customers' needs with high technology and quality.
Break through the yen depreciation and procurement risks caused by international circumstances! Complete domestic transfer with automotive quality (IATF16949 certification) and cost performance through unique routes.
We provide consistent support from design to final product release! *We have a track record of adoption for the supercomputer "K".
3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components
We are committed to high-quality manufacturing and a 100% on-time delivery rate.
Substrate mounting [SMT (Surface Mount Technology)] can accommodate chip sizes from 0402 and substrate sizes from 30×50mm! Both leaded and lead-free options are available.



























































































































