List of Manufacturing and processing machinery products

  • classification:Manufacturing and processing machinery

4501~4545 item / All 100305 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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Expanding the next generation with trading company functions and manufacturing! We respond to needs with reliable technical expertise.

  • Other machine elements
  • Other food machinery
  • Other electronic parts

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A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

  • High pressure cleaner
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.

  • Other semiconductor manufacturing equipment

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Detecting "bulges" and "dents" defects through high-density 3D inspection! Sorting into good products and defective products.

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  • Visual Inspection Equipment
  • Other inspection equipment and devices
  • Automatic sorting machine

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Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.

  • Other semiconductor manufacturing equipment
  • others
  • Other Connectors

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A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.

  • Soldering Equipment
  • Reflow Equipment

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Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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This is an annealing furnace manufactured by Unitemp Japan, applicable to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN.

  • Soldering Equipment
  • Heating device

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This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. 【Testable】

  • Soldering Equipment
  • Heating device

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Metal-compatible tags that can also be printed and encoded! High-performance label tags developed for the metal surfaces of everyday items and industrial products.

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  • IC tag
  • label
  • Special labels, etc.

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We have achieved continuous welding of CFRTP, which was difficult with conventional technology, through our unique ultrasonic welding technology.

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  • Secondary Cells/Batteries
  • Plastic processing machines (cutting and rolling)

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Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]

【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000

A lineup of top-class inkjet coating equipment! Complete with demonstrations of inkjet coating devices and a well-equipped coating test environment.

  • Painting Machine

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Non-contact lead-free soldering laser unit compatible with fine thermal control resin bonding.

  • Soldering Equipment

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High-speed Die Bonder compatible with micro and thin chips!

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)

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A new microball system that meets individual piece needs! Reduces ball consumption.

  • Circuit board processing machine

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The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!

  • Tester

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It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!

  • Tester

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Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!

  • Mounter

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Features stable solder ball mounting and improves productivity through an inline system.

  • Other semiconductor manufacturing equipment

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Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

  • Semiconductor inspection/test equipment

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Freeze-drying of fine particles is possible! Testing available for cosmetics, microorganisms, regenerative medicine, and more.

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  • Other machine tools

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We are currently conducting test drying for customers considering the introduction of freeze-drying equipment!

  • Other food machinery

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A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

  • Other semiconductor manufacturing equipment

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

  • Other semiconductor manufacturing equipment

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Notice of Participation in "Semicon Japan 2018"

We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009

A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

  • Soldering Equipment
  • Reflow Equipment

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This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.

  • Soldering Equipment
  • Heating device

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A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)

  • Annealing furnace

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Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

  • Ultrasonic Oscillator
  • Other cutting tools
  • Other processing machines

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

Manual flip chip bonder suitable for small-scale production and various experiments.

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  • Bonding Equipment

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Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.

  • Printed Circuit Board
  • LCD display
  • Other semiconductor manufacturing equipment

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A rich lineup is available! Demonstrations of inkjet coating equipment and a well-equipped coating test environment are provided.

  • Painting Machine
  • Other surface treatment equipment

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Before considering or purchasing inkjet evaluation machines and mass production equipment, for those who wish to conduct a test once, and for customers who have been evaluated by other companies but w...

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  • Processing Contract
  • Other contract services

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Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

  • Assembly Machine
  • Other semiconductor manufacturing equipment

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The blue light blue laser is changing the world of soldering! The "BLES system" achieves soldering without flux, which has been difficult until now.

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  • Soldering Equipment

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Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.

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  • Laser marker

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By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...

  • Semiconductor inspection/test equipment

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A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.

  • Other semiconductor manufacturing equipment

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Coating functional ink on wafers, sheets, glass, resin substrates, etc.!

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  • Painting Machine

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