List of Contract Services products
- classification：Contract Services
76～90 item / All 2261 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
We provide total support for RFSOC development and FPGA development.
- Embedded system design service
- Circuit board design and manufacturing
- Embedded Board Computers
For the manufacturing of circuit boards used in harsh environments such as vibrations and salt damage! We deliver highly durable circuit boards using know-how unique to fishing equipment operating in ...
- EMS
If you're having trouble finding a contractor that can handle small lot manual assembly... we will take care of everything from design and procurement to assembly, starting from just one prototype.
- EMS
For soldering microchips of size 0603! Skilled artisans precisely hand-assemble under a microscope, ensuring delivery with quality equivalent to that of machines.
- EMS
It is a domestic EMS service specialized in high quality, small lots, and low cost, accommodating a variety of products.
- EMS
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of elec...
- Coating Agent
- Circuit board design and manufacturing
- Other electronic parts
We will exhibit at Interop Tokyo (Autumn) from September 9 (Wednesday) to September 11 (Friday), 2026 at Makuhari Messe.
"Hot melt molding," which solidifies in just a few dozen seconds and is attracting attention as a waterproof sealing method for electrical components. Our company will be exhibiting at Internepcon Japan (Autumn) from September 9 (Wednesday) to September 11 (Friday). On that day, we will showcase actual electrical components that have adopted hot melt molding both domestically and internationally. We look forward to your visit. We sincerely await your attendance.
To address quality issues and delays in parts procurement due to overseas outsourcing! We provide credit supplementation through our procurement network, delivering from PCB assembly to inspection, as...
- EMS
- Printed Circuit Board
For the development and manufacturing of small IoT devices and precision equipment! We provide a comprehensive in-house system from material procurement to PCB assembly, inspection, assembly, packagin...
- EMS
- Printed Circuit Board
Support from the integration of discrete circuits to the regeneration of EOL products.
- Circuit board design and manufacturing
- Prototype Services
- Dedicated IC
Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.
- Other semiconductors
- EMS
- Dedicated IC
A one-stop LSI turnkey service that supports everything from organizing requirements specifications to LSI design, evaluation, prototyping, and mass production.
- Circuit board design and manufacturing
- Prototype Services
- Dedicated IC
This is an introduction to a power supply device for semiconductor lasers that adopts a multi-phase drive switching method.
- Switching Power Supply
- power supply
- Circuit board design and manufacturing
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniq...
- Printed Circuit Board
- Circuit board design and manufacturing
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
[Press Release from Taiyo TechnoRex] Established 4-layer FPC manufacturing technology using MSAP method, achieving 10μm/20μm fine wiring and accelerating expansion into next-generation communications, AI, and ADAS fields.
Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.