List of For Techies products
- classification：For Techies
421～435 item / All 4716 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Enhancing rust prevention for automobiles! Here is an explanation of the basics of electrocoating.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating that contributes to the longevity of infrastructure facilities.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrophoretic painting that helps ensure the insulation of OA machines.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating to enhance the durability and aesthetics of stationery.
- Coating Agent
- Technical and Reference Books
![[Book] Reducing CTE in Semiconducto...](https://image.mono.ipros.com/public/product/image/342077/IPROS9071615174886190092.gif?w=280&h=280){kind=small}
[Available for preview] ~ Chiplets, responding to 2.5D/3D high-density packaging ~
- Technical and Reference Books
[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) [Available for preview]
~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------
![[Book] Materials Informatics (No. 2...](https://image.mono.ipros.com/public/product/image/342077/IPROS15036913493640052264.gif?w=280&h=280){kind=small}
[Available for preview] - High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions.
- Technical and Reference Books
[Book] Development of Polymer Materials through Materials Informatics (No. 2365) [Available for preview]
- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------
![[Book] Removal and Prevention of Bi...](https://image.mono.ipros.com/public/product/image/342077/IPROS3927512216342148316.gif?w=280&h=280){kind=small}
【Available for preview】◎ A complete manual for the removal of biofilm to break through "slime" and "resistance" for the field!
- Technical and Reference Books
【Book】Development of Biofilm Removal, Prevention, and Formation Inhibitors (No.2363) 【Available for preview】
◎ A Complete Manual for the Removal of Biofilms to Overcome "Slime" and "Resistance" for the Field! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Mechanisms of Biofilm Formation Chapter 2: Various Evaluation Methods for Biofilms Chapter 3: Evaluation Methods for the Development of Anti-Biofilm Products Chapter 4: Types and Characteristics of Anti-Biofilm Agents Chapter 5: Development of Anti-Biofilm Agents from the Perspective of Bacterial Adhesion Prevention Chapter 6: Mechanisms of Biofilm Formation Inhibition and Development of Anti-Biofilm Agents Chapter 7: Control, Removal, and Prevention Measures for Oral and Infection-Derived Biofilms Chapter 8: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Living Environments Chapter 9: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Food Chapter 10: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: July 31, 2026 ● Format: A4, 384 pages ● Authors: 65 ● ISBN: 978-4-86798-161-0 －－－－－－－－－－－－－－－－－－－－－
![[Book] Dynamic Viscoelasticity Meas...](https://image.mono.ipros.com/public/product/image/572/2000674194/IPROS31076941735868389271.jpeg?w=280&h=280){kind=small}
Technical Specialized Books - Polymers, Composite Materials, Emulsions, Suspensions, Gels, Cosmetics, Food -
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Dynamic Viscoelasticity Measurement and Its Data Interpretation Cases (No. 2135BOD)
■Table of Contents Chapter 1: Measurement Methods and Simulation of Dynamic Viscoelasticity Chapter 2: Measurement of Dynamic Viscoelasticity of Polymers and Composite Materials and Case Studies of Data Interpretation Chapter 3: Setting Conditions and Evaluation of Molding and Processing Processes Utilizing Dynamic Viscoelasticity Measurement Data Chapter 4: Measurement of Dynamic Viscoelasticity of Gels and Case Studies of Data Interpretation Chapter 5: Measurement of Dynamic Viscoelasticity of Pastes, Coatings, and Adhesives and Case Studies of Data Interpretation Chapter 6: Measurement of Dynamic Viscoelasticity of Cosmetics and Case Studies of Data Interpretation Chapter 7: Measurement of Dynamic Viscoelasticity of Foods and Case Studies of Data Interpretation －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: December 24, 2021 ●Authors: 57 ●Format: A4 size, 589 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-866-1 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-047-7 After receiving your order, we will perform simple printing and binding －－－－－－－－－－－－－－－－－－－－－－－－－－
Instead of training to "know" AI, we offer training that is "usable" in business. Customization of training themes is also possible.
- Technical Seminar
We will standardize skills using training content utilizing the metaverse and improve the corporate level!
- Distance learning/E-learning
- Other services
The hegemony strategy of "materials, interfaces, and thermal control" that takes away profits from AI semiconductors!
- Technical and Reference Books
- Other semiconductors
- others
[Free event on 9/3] Ministry of Economy, Trade and Industry presentation! We will explain the current state and challenges of Japan's manufacturing industry based on the 2026 edition of the White Pape...
- Technical Seminar
- Seminar