List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

166~180 item / All 5106 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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Shape observation and simple quantitative analysis using SEM-EDX.

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  • Contract Inspection
  • Wafer
  • Other semiconductor manufacturing equipment

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Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.

  • Other semiconductor manufacturing equipment

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Notice of Exhibited Products and Events for Nepcon Japan 2024

We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.

We propose a custom-made dispenser that fulfills your ideals.

  • Other semiconductor manufacturing equipment

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Achieved over 50% higher throughput compared to conventional serial testers by adopting Per-Pin architecture!

  • Tester

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Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!

  • Tester

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Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

Supports PAM4/NRZ signals and covers the 1.6TBASE/CEI-224G standard!

  • Tester

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opie invitation.png

Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=

Ideal for transporting thin wafers, glass substrates, metal foils, films, and more! Eliminates localized stress on the objects caused by conventional vacuum suction methods!

  • Other semiconductor manufacturing equipment

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High-Spec Dedicated Load Grinding Device

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  • Wafer processing/polishing equipment

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A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!

  • Wafer processing/polishing equipment
  • Other abrasives

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Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!

  • Wafer processing/polishing equipment
  • Other abrasives

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Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

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  • Wafer processing/polishing equipment
  • Other abrasives

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A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!

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  • Analytical Equipment and Devices
  • Moisture Measuring Device
  • Semiconductor inspection/test equipment

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The standard seismic isolation device "ISO-Base" can be retrofitted, reconfigured, and reused! Earthquake protection for IT equipment has become surprisingly easy.

  • Other semiconductor manufacturing equipment

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We will be exhibiting at the 32nd Industrial Technology Exhibition "Technical Show Yokohama" from February 2 (Wednesday) to February 4 (Friday), 2011.

We will be exhibiting at the Technical Show Yokohama held at Pacifico Yokohama. The exhibits will include: - Key management made easy! "IC Key Terminal" - Access control system - Production management system, production scheduler and more. We invite you to take this opportunity to see our products. If you would like an invitation ticket, please write "Request for invitation ticket" to info@biss.co.jp and provide your contact information. You can also do this through the Ipros page. You can find more details below: http://www.ipros.jp/company/254201/products_detail000000040.html

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...

  • Other semiconductor manufacturing equipment
  • Other semiconductors
  • Technical Seminar

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