List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1036～1080 item / All 4990 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Ideal for processing in areas where tools cannot reach! Capable of deburring and adding radii, among other tasks.
- Wafer processing/polishing equipment
It is possible to provide a large frictional force instantaneously! Due to its high volumetric efficiency, it excels in mass production.
- Wafer processing/polishing equipment
Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.
- Wafer processing/polishing equipment
Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!
- Wafer processing/polishing equipment
Reproducibility in sample grinding
- Wafer processing/polishing equipment
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
- Bonding Equipment
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
- Bonding Equipment
We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.
- Other semiconductor manufacturing equipment
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
- Bonding Equipment
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
- Bonding Equipment
We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.
- Analytical Equipment and Devices
- Other machine elements
- Semiconductor inspection/test equipment
We will exhibit at the 2024 Japan Proteomics Society Annual Meeting and the 20th Joint Meeting of the Japanese Clinical Proteogenomics Society.
Our company will be exhibiting at the Joint Conference of the 2024 Annual Meeting of the Japanese Proteomics Society and the 20th Annual Meeting of the Japanese Clinical Proteogenomics Society, which will be held at Link Station Hall Aomori from June 26 to 28, 2024. At our booth, we will showcase a complete set of interfaces that enable high-sensitivity measurements using capillary electrophoresis-mass spectrometry (CE-MS). We invite anyone using CE-MS, as well as those who own an MS and are interested in utilizing capillary electrophoresis, to visit our booth.
[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!
- CMP Equipment
Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.
- Other semiconductor manufacturing equipment
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
- Sputtering Equipment
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!
- CVD Equipment
For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.
- Coater
A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.
- Coater
For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.
- Coater
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!
- CVD Equipment
Full support for testing transmission standards of 800G/400G/200G/100G!
- Tester
A modular measurement platform for testing optical passive components 24 hours a day, 365 days a year!
- Tester
It is a manual polishing device for a luminescence spectroscopic analysis apparatus.
- Wafer processing/polishing equipment
With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.
- CVD Equipment
Customize the optical integrated circuit you want to measure! Introducing our testing solutions.
- Tester
Starting the 800GbE point-to-point test, also supporting breakout tests with 2x400GbE and 8x100GbE!
- Tester
Achieving high-quality polishing that retains the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves edges through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves edges through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves the edge through automation.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.
- Etching Equipment
Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.
- 3D CAD
- Other CAD
- Wafer processing/polishing equipment
Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.
- Photomask
The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.
- Wafer processing/polishing equipment
Non-contact transport of wafers and glass substrates using ultrasound! It's a clean transport technology! No contamination from contact! No contamination risk from air blow!
- Other semiconductor manufacturing equipment
- Secondary Cells/Batteries
- Other conveying machines
We will provide you with the latest information on "Majesty-DI."
- Printed Circuit Board
- Photomask
- Substrate transport device (loader/unloader)
Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!
- Wafer processing/polishing equipment
- Processing Contract
We provide sapphire components with wide transparency characteristics, hardness, chemical stability, heat resistance, and good thermal conductivity.
- Etching Equipment
Compatible with SFP112/QSFP112! Can be mounted in the compact FTB-1 HPDC chassis.
- Tester
The three yoke supporters (polishing jig support arms) can be individually adjusted!
- Wafer processing/polishing equipment
An intuitive 7-inch LCD touch panel control unit that can save and edit 20 sets of data!
- Wafer processing/polishing equipment
Adopts a high torque output 750W servo motor! Maintains stable torque output.
- Wafer processing/polishing equipment
Equipped with a powerful DC motor controlled by electricity! Strong horsepower and long lifespan.
- Wafer processing/polishing equipment