List of Semiconductor Manufacturing Equipment products
- classification:Semiconductor Manufacturing Equipment
1351~1395 item / All 5117 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
The ultra-thin metal sleeve can be flexed like resin for use and has excellent heat resistance, corrosion resistance, wear resistance, and mechanical strength.
- Other semiconductor manufacturing equipment
Significantly improve the thermal conductivity of thin-walled seamless pipes! It is also possible to impart properties such as corrosion resistance and permeability to magnetism due to the characteris...
- Other semiconductor manufacturing equipment
Successful practical application of ultra-thin seamless sleeves (thin-walled pipes) made of clad material (multilayer steel)!
- Other semiconductor manufacturing equipment
Precision lock nut of the pre-bleeding torque type.
- Other semiconductor manufacturing equipment
It is an optical filter that selectively transmits ultraviolet wavelengths (255 nm) while blocking light of other wavelengths (using a substrate from Gohsui Seiko Glass).
- Other optical parts
- Sensors
- Other semiconductor manufacturing equipment
Co-creation proposal! Added 'Agriculture × Optical Films' as a technology trend keyword.
In recent years, technological innovations in the agricultural sector have significantly shifted from traditional biological approaches such as soil improvement and breeding to an engineering concept of "designing the environment itself." Particularly noteworthy is smart agriculture, which integrates precise control of light environments with sensing technology. Plant growth is complexly determined not only by light intensity but also by wavelength distribution, angle of incidence, temporal variations, and interactions with surrounding temperatures. In other words, agriculture can essentially be described as "the science of spectral control." In this context, optical thin films and optical filters play an extremely important role. Optical thin films are functional materials that allow for precise design of reflectivity, transmittance, absorbance, and interference characteristics through control of film thickness on the nanometer scale. By using multilayer interference structures, it is possible to selectively transmit and reflect specific wavelengths, which directly contributes to optimizing effective light for photosynthesis in plants and controlling unwanted infrared and ultraviolet light. For more information, please check our company website.
Finishing can be achieved with a consistent quality without the need for skilled craftsmanship, just like in the buffing process!
- Wafer processing/polishing equipment
TiC treatment and TiCN treatment are possible! It can be used under harsher conditions than PVD treatment.
- CVD Equipment
Super sonic spraying of water droplets and vapor below 30μm effectively removes stubborn dirt such as cutting oil. Cleaning is possible even in narrow spaces.
- Other semiconductor manufacturing equipment
We apply hard DLC (diamond-like carbon) through sputtering, suitable for medical supplies and automotive parts! *Demo tests are currently being conducted.
- Sputtering Equipment
DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.
- Sputtering Equipment
It is a device that can be transitioned from a pilot line to a mass production line.
- Sputtering Equipment
There are five expansion slots, allowing for additional installation of sputter chambers, deposition devices, glove boxes, etc.
- Sputtering Equipment
Reduce damage to the substrate by over 60%! Improve film formation speed while maintaining low damage characteristics.
- Sputtering Equipment
Announcement of Exhibition at Kansai Metal Japan by Keihin Ramtech
We sincerely thank you for your continued patronage. We are pleased to announce that, following last October, our company will be exhibiting at Kansai Metal Japan held in Osaka. We will showcase the upgraded technologies and lineup of Ramtech, which have been enhanced to withstand the challenges posed by the new coronavirus. We kindly ask for your consideration in visiting us. We look forward to seeing you there.
We have achieved data digitization through our own experience and achievements, along with the cooperation of a specialized manufacturer of chip saws.
- Wafer processing/polishing equipment
- Processing Contract
Would you like to achieve efficiency in repair and maintenance inspection operations and improve customer satisfaction with the core business package "ServAir" for after-sales service?
- Semiconductor inspection/test equipment
ServAir Cloud V4.3 has released the "BI Option."
We are pleased to announce the release of the after-sales service core business package, ServAir Cloud V4.3. In V4.3, we will offer a new BI (Business Intelligence) option. You will be able to analyze various data from ServAir and create graphs using the BI tool QuickSight provided by AWS Japan (Amazon Web Services Japan LLC). ServAir's data will be available in a format that can be easily utilized on QuickSight, allowing you to perform data analysis, forecasting, create various graphs, and manage KPIs on your own. This enables you to manage, analyze, and share data tailored to your business goals. V4.3 is scheduled to go on sale on December 15, 2023, and to start shipping on January 26, 2024. Please feel free to contact us for an introduction to the product, including the new features of V4.3.
A screen made using etching processing and metal diffusion bonding technology! Introducing with photos.
- Processing Contract
- Etching Equipment
We provide a wide range of services for precision cleaning, from large semiconductor equipment and components to small parts.
- Other semiconductor manufacturing equipment
Microfabrication for glass substrates, optical films, and various high-performance films!
- Etching Equipment
- Processing Contract
We can accommodate various quantities from small amounts to mass production! We offer a wide variety of silica sand.
- Wafer processing/polishing equipment
Ideal for processing in areas where tools cannot reach! Capable of deburring and adding radii, among other tasks.
- Wafer processing/polishing equipment
It is possible to provide a large frictional force instantaneously! Due to its high volumetric efficiency, it excels in mass production.
- Wafer processing/polishing equipment
Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.
- Wafer processing/polishing equipment
Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!
- Wafer processing/polishing equipment
Reproducibility in sample grinding
- Wafer processing/polishing equipment
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
- Bonding Equipment
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
- Bonding Equipment
We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.
- Other semiconductor manufacturing equipment
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
- Bonding Equipment
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
- Bonding Equipment
We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.
- Analytical Equipment and Devices
- Other machine elements
- Semiconductor inspection/test equipment
We will exhibit at the 2024 Japan Proteomics Society Annual Meeting and the 20th Joint Meeting of the Japanese Clinical Proteogenomics Society.
Our company will be exhibiting at the Joint Conference of the 2024 Annual Meeting of the Japanese Proteomics Society and the 20th Annual Meeting of the Japanese Clinical Proteogenomics Society, which will be held at Link Station Hall Aomori from June 26 to 28, 2024. At our booth, we will showcase a complete set of interfaces that enable high-sensitivity measurements using capillary electrophoresis-mass spectrometry (CE-MS). We invite anyone using CE-MS, as well as those who own an MS and are interested in utilizing capillary electrophoresis, to visit our booth.
[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!
- CMP Equipment
Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.
- Other semiconductor manufacturing equipment
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
- Sputtering Equipment
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!
- CVD Equipment
For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.
- Coater
A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.
- Coater
For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.
- Coater
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!
- CVD Equipment
It is a manual polishing device for a luminescence spectroscopic analysis apparatus.
- Wafer processing/polishing equipment
With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.
- CVD Equipment
Achieving high-quality polishing that retains the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves the edge through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Achieving high-quality polishing that preserves edges through mechanization.
- Wafer processing/polishing equipment
We will exhibit at the SURTECH 2025 trade show.
We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/