List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1351~1395 item / All 5022 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

  • Satech - AdaptaGuard_Ipros_2023_JP_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_1.jpg
  • Satech - FastGuard_Ipros_2023_JP_2.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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Full automatic sputter coater with magnetron cathode to reduce ion damage.

  • Sputtering Equipment

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San-Yu Electronics, sputtering devices, vacuum deposition equipment, SEM/electron microscope-related equipment.

  • Coater

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Compatible with Ni/Cr/W and more! Achieving high-precision control through software control.

  • Coater

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The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

  • Bonding Equipment

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Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors

Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp

Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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The crystallization of technology! It is used in the process of making semiconductors found in smartphones.

  • Plastic utensils and containers
  • Other semiconductor manufacturing equipment

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Built-in 10 types of polishing/etching conditions suitable for various materials! Short polishing time and high reproducibility.

  • Wafer processing/polishing equipment
  • Etching Equipment

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Leave the high-difficulty double-sided grinding processing to us.

  • Wafer processing/polishing equipment

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The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.

  • Bonding Equipment

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High-speed, high-efficiency grinding, long lifespan, good grinding efficiency, minimal damage to the work surface, and excellent surface finish.

  • Grindstone
  • Wafer processing/polishing equipment
  • Grinding Machine

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Excellent grinding efficiency and finish, extended dressing intervals, low cutting energy, minimal chipping, good uniformity, flatness, surface roughness, and excellent parallelism.

  • Grindstone
  • Grinding Machine
  • CMP Equipment

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Maintenance and renewal will be carried out by reliable technicians directly connected to the manufacturer.

  • Other semiconductor manufacturing equipment
  • Used goods purchase

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Multiple machine handling and automation of other processes with robots! We propose suitable robot implementation.

  • Wafer processing/polishing equipment

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Introducing "transparent YAG ceramics" with optical properties equal to or superior to those of YAG single crystals!

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  • Other semiconductor manufacturing equipment

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IC socket

  • Semiconductor inspection/test equipment
  • Other semiconductors
  • socket

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Anisotropic conductive sheet

  • Semiconductor inspection/test equipment
  • Other semiconductors
  • others

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W-CSP inspection probe card

  • Semiconductor inspection/test equipment
  • Other semiconductors
  • Printed Circuit Board

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Consolidating decades of technology developed with contact probes for semiconductor testing!

  • Semiconductor inspection/test equipment
  • Other semiconductors
  • Printed Circuit Board

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We will introduce product information by genre for various precision tools and fixtures used in semiconductor manufacturing, as well as individual product specifications.

  • Semiconductor inspection/test equipment
  • Other semiconductors
  • Printed Circuit Board

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Leave the sale of used semiconductor equipment and parts to us.

  • Other semiconductor manufacturing equipment

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STEM-EDS observation can confirm the shape and layer structure of the insulating film between semiconductor Poly-Si (polysilicon) and can be applied to investigate the causes of semiconductor defects.

  • Semiconductor inspection/test equipment
  • Contract Analysis
  • Other semiconductors

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Quick response to on-site confirmations! Introducing examples of responses to issues discovered during regular inspections.

  • Coater
  • Calibration and repair

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Introducing our lineup of dedicated rod polishers and pipe polishers!

  • Wafer processing/polishing equipment

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We provide a one-stop service from semiconductor test development to the launch of semiconductor testing and semiconductor testing outsourcing.

  • Semiconductor inspection/test equipment

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We have a proven track record in static electricity measures and charge prevention, from atmospheric environments to vacuum environments.

  • Other semiconductors
  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a single cable that combines optical fiber and electric wires. Since it can be laid in one go, communication and power supply can be restored simultaneously.

  • LAN/Optical cable
  • Other semiconductor manufacturing equipment

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Reduce the burden on operators! Equipped with a copying device, automatic return device for processed materials, and automatic pad device as standard.

  • Other processing machines
  • Wafer processing/polishing equipment

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Adopting a special sanding roll! You can easily position it with a single touch by entering the desired dimensions.

  • Other processing machines
  • Wafer processing/polishing equipment

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Automatic elevation during connection is also possible! A special air tension device that makes attaching and detaching the sanding belt and adjusting tension easy.

  • Other processing machines
  • Wafer processing/polishing equipment

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Minimum processing thickness 0.2mm! Suitable for grinding materials like veneer, with a height-adjustable flat surface.

  • Wafer processing/polishing equipment
  • Other processing machines

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Grinding of metals and non-ferrous metals without dust scattering! High-quality deburring is possible.

  • Wafer processing/polishing equipment
  • Grinding Machine
  • Other processing machines

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Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

  • Sputtering Equipment

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Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.

Compatible with large substrates! High-speed beam adjustment using a fully automated power control system.

  • Ion implantation equipment
  • DC Motor

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A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

  • Sputtering Equipment

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HEX-6 220x220.png

Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.

Organic deposition source for the multipurpose vacuum deposition device HEX system.

  • Sputtering Equipment

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HEX-6 220x220.png

Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.

Rich experience in processing various materials and substrates! Electromagnetic wave shielding, static electricity prevention, surface heating elements, etc.

  • Sputtering Equipment

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Substrate × Film = Optical adjustment, conductivity, antibacterial/antiviral! Exhibits heat insulation and thermal retention effects.

  • Sputtering Equipment

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Suppress the growth of bacteria/viruses with metals/alloys! Sputtering processing on fibers is possible.

  • Sputtering Equipment

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Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.

  • Sputtering Equipment

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Various antibacterial/antiviral treatments, anti-mold, etc.! Sputtering processing on fibers and films.

  • Sputtering Equipment

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Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.

  • Sputtering Equipment

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Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

  • Sputtering Equipment

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HEX-6 220x220.png

Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

  • Sputtering Equipment

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HEX-6 220x220.png

Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability

The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.

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