List of Mounting Machine products
- classification：Mounting Machine
2011～2025 item / All 2133 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Seed blowing and dual use. Few troubles and low maintenance costs. AGD, AGPM soil-blowing machines.
- Other mounting machines
For greening substrate materials and chip materials. Available for supply with shovels or precast.
- Other mounting machines
High performance, high safety, excellent mobility, low running costs, AG-150II.
- Other mounting machines
A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.
- Other painting machines
- Mounter
This laminator supports wafers from 4 inches to 8 inches, has a compact design that can be placed on a tabletop, and is easy to operate even for beginners.
- Other painting machines
- Mounter
Space reduction of 35% (compared to our company)! The inspection device is built into the main unit, allowing operations to be performed on the same control screen!
- Other mounting machines
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production with automatic ACF attachment.
- Circuit board processing machine
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
High-density plasma is generated over a large area by a unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Plasma surface treatment equipment
- Molding Equipment
- Circuit board processing machine
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/
High-density plasma is generated over a large area by the unique reactor head!
- Molding Equipment
- Circuit board processing machine
- Plasma surface treatment equipment
Announcement of the start of sales for the "Atmospheric Pressure Air Plasma Device" that requires no gases such as argon or nitrogen, by Well Corporation.
Well Corporation has started selling an atmospheric air plasma device in Japan that generates ultra-high-density radicals using only air, without the need for gases such as argon or nitrogen. This device has already been delivered over 400 times in overseas markets. Compared to conventional argon plasma devices, its main features are high-speed processing, low running costs, and damage-free plasma. □ Features - Ultra-high-density radical generation - Potential-free plasma (can directly irradiate plasma onto fine wiring patterns) - High-speed processing (3 to over 10 times faster than conventional methods) - Low running costs (no need for argon or nitrogen gas, AC100V power supply) □ Main Applications - Wire bonding pre-treatment - Semiconductor pad plating pre-treatment - Die bonding pre-treatment ≪Inquiries regarding this matter≫ Well Corporation, Implementation Solutions Sales Department 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-plasma.jp/