IC bonding device
A desktop semi-automatic machine for cell production that performs IC bonding at one location on the LCD and FPC.
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basic information
【Specifications】 ■LCD Size: 1 to 5 inches ■Tact: 15 seconds ■Device Dimensions: 300W x 450D x 520H ■Weight: 35Kg
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Applications/Examples of results
【Applications and Examples of Achievements】 LCD module manufacturing applications Overseas LCD assembly manufacturers 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://www.welljp.co.jp/lcd.html Company Information http://www.welljp.co.jp/
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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