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  6. FPC alignment and crimping device

FPC alignment and crimping device

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ZO-FPC-AB-01

last updated:Jun 17, 2011

ウェル
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Tabletop semi-automatic machine for cell production use.

A desktop semi-automatic machine for cell production that aligns and performs main pressing of FPC at one location on the LCD and PCB.

    Bonding EquipmentOther semiconductor manufacturing equipmentCircuit board processing machine
product2.JPG

FPC alignment and crimping device

product2.JPG
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  • Related Link - http://www.welljp.co.jp

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basic information

【Specifications】 ■LCD Size: 1 to 5 inches ■FPC Size: 70 to 120 mm ■LCD Thickness: 0.3 to 1.5 mm ■FPC Alignment Accuracy: ±20 μm ■Cycle Time: 15 sec ■Device Dimensions: 250W x 450D x 550H ■Weight: 35 kg

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【Achievements】 Overseas LCD module assembly manufacturer 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://www.welljp.co.jp/lcd.html Company Information http://www.welljp.co.jp/

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Flip chip assembly related equipment

Flip chip assembly related equipment

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Electronic Components and Semiconductors

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Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."

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