List of Semiconductors and ICs products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

• Cooling system

The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

• Contract Analysis
• magnet
• Memory

Microscopic structural analysis of amorphous films is possible through simulation.

• Contract Analysis
• Memory

It is possible to confirm the stress distribution in the sample cross-section.

• Contract Analysis
• Wafer

It is possible to evaluate trace metals in ppm orders.

• Contract Analysis
• Ceramics
• Wafer

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

• Contract Analysis
• Transistor
• Power storage device

Non-destructive three-dimensional observation of the internal structure of a discrete package.

• Contract Analysis
• Other semiconductors

Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

• Contract Analysis
• Other semiconductors

Evaluation of microscopic atomic structures is possible through computational simulation.

• Contract Analysis
• Other semiconductors

Reverse engineering of DRAM on the product's internal substrate.

• Contract Analysis
• Memory

It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.

• Contract Analysis
• Memory

It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

• Contract measurement
• Transistor
• Memory

Simultaneous measurement of inorganic and organic components in minute specific areas.

• Contract measurement
• Wafer
• Memory

We evaluate abnormalities inside the device non-destructively.

• Contract Analysis
• Other electronic parts
• Transistor

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

• Wafer
• Contract measurement
• Other semiconductors

Shape observation and simple quantitative analysis using SEM-EDX.

• Contract Inspection
• Wafer
• Other semiconductor manufacturing equipment