List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1171～1185 item / All 4813 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
The GS8 series is a high-speed, large-capacity synchronous SRAM that can be supplied for a long term.
- Memory
The SigmaDDR series is a high-speed DDR II SRAM that is fully compatible with products from other companies such as Cypress.
- Memory
The LL DRAM II has finally arrived from SRAM manufacturer GSI Technology.
- Memory
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 12.5 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
Aluminum extruded heat sink with dimensions 27 mm wide x 22 mm high - available in various lengths.
- Other semiconductors
New BGA 24-pin is here! Non-volatile memory that achieves high-speed writing and long-term retention! Numerous achievements in industrial equipment such as rotary encoders with non-volatile, low power...
- Memory
- Memory
Clip-type rail mount that allows for quick attachment of heat sinks, cases, etc. to DIN rails compliant with TS35 standards.
- Other semiconductors
Aluminum clip for fixing heat sink and aluminum case to DIN rail.
- Other semiconductors
We offer silicon wafers such as particle management wafers and dummy mirror wafers!
- Wafer
- Other semiconductors