List of Semiconductors and ICs products
- classification:Semiconductors and ICs
631~675 item / All 4824 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
"The detailed drawings of the device are incomplete and the deadline is approaching..." We address such concerns. We can flexibly respond by refining the drawings according to the production status.
- tank
- Other semiconductors
- Other cleaning machines
Optimal for 3-shunt motor control! Threshold voltage can be set with an external resistor!
- ASIC
Stable supply of high-precision voltage! We offer three types of PGK.
- ASIC
We provide suitable solutions that meet the advanced needs of power semiconductor manufacturing!
- Other semiconductors
- Other Auto Parts
- Ceramics
For cutting and polishing large products such as stone, quartz glass, fireproof bricks, and concrete.
- Other semiconductors
A device that changes the "quality" of circulating water and removes scale by performing special electrolysis on the circulating water without using chemical agents.
- Other semiconductors
High-performance aluminum structural materials that meet all the needs of FA, from LCD and semiconductor equipment to various industrial machinery.
- Other semiconductors
High heat resistance: SX-200 can be used continuously at 400°C! Radiation resistance: over 109 RAD.
- Other semiconductors
Further pursuit of lightweight and compact design. The inner diameter of the tube ranges from φ2.5 to φ250, allowing for a wide variety of uses from simple applications to more advanced ones.
- Other semiconductors
Equipped with a slow start, slow stop mechanism, speed controller, digital timer minimizer, and a linkage system for automatic spraying devices, etc.
- Other semiconductors
We guarantee consistently stable wraps and promise a magnificent mirror finish.
- Other semiconductors
Extremely uniform with minimal lot variation.
- Other semiconductors
It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.
- Other semiconductors
PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.
- Other semiconductors
Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)
- Other semiconductors
It is an abrasive with strong crushing strength and thermal stability.
- Other semiconductors
A lineup of 5 types of grain sizes.
- Other semiconductors
As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.
- Other semiconductors
We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.
- diode
- Contract measurement
- Composite Materials
Announcement of the Start of Non-Destructive Testing Services from April 2018
On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.
GC/MS: Gas Chromatography-Mass Spectrometry
- Contract Analysis
- Memory
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
You can investigate the changes in degassing intensity while maintaining the temperature.
- Contract Analysis
- Memory
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.
- Contract Analysis
- Transistor
- Power storage device
Non-destructive three-dimensional observation of the internal structure of a discrete package.
- Contract Analysis
- Other semiconductors
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
- Contract Analysis
- Other semiconductors
Evaluation of microscopic atomic structures is possible through computational simulation.
- Contract Analysis
- Other semiconductors
Reverse engineering of DRAM on the product's internal substrate.
- Contract Analysis
- Memory
It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.
- Contract Analysis
- Memory
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract measurement
- Transistor
- Memory
Simultaneous measurement of inorganic and organic components in minute specific areas.
- Contract measurement
- Wafer
- Memory
We evaluate abnormalities inside the device non-destructively.
- Contract Analysis
- Other electronic parts
- Transistor
Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.
- Wafer
- Contract measurement
- Other semiconductors
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
It is effective to differentiate between the two methods depending on the surface structure of interest.
- Contract Analysis
- Memory
High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.
- Contract Analysis
- Wafer
- Water quality testing