List of Contract Services products

  • classification:Contract Services

856~870 item / All 4755 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

  • Satech - AdaptaGuard_Ipros_2023_JP_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_1.jpg
  • Satech - FastGuard_Ipros_2023_JP_2.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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You can download a free booklet that introduces the uses, structures, and examples of various types of frames.

  • Other machine tools
  • Solar power generator
  • Other energy equipment

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By combining the VR-6200 with the heater stage, it becomes possible to visualize changes during heating.

  • Contract Inspection

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Observation of thermal deformation using a 3D shape measuring machine (VR-6200)

This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.

We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.

  • Contract Analysis
  • Contract Inspection
  • Analytical Equipment and Devices

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Evaluation of various implementation substrates

At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.

In-Situ Continuous Measurement Reliability Evaluation Testing Service

  • Contract Inspection
  • Testing Equipment and Devices
  • Other inspection equipment and devices

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Observation of substrate deformation using a 3D shape measuring device (VR-6200)

I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

  • Contract Analysis
  • Transistor
  • Analytical Equipment and Devices

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TEM_TalosF200E.jpg

Announcement of the introduction of Talos F200E

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

  • Contract Analysis
  • Other contract services
  • Contract measurement

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?Observation of tire cross section.jpg

Cryogenic ion milling cross-section processing example (rubber products)

We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

It is possible to observe cross-sections while observing FIB processing in real time.

  • Contract Analysis
  • Other contract services
  • Electron microscope

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Power device failure location / Slice & View three-dimensional reconstruction

I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.

We provide testing services to evaluate the resistance to ESD (electrostatic discharge), which is important for the reliability of semiconductor products and electronic components that include them.

  • Contract Inspection
  • Other contract services
  • Other inspection equipment and devices

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We offer testing services to evaluate the resistance of the Charged Device Model (CDM) to ESD.

  • Contract Inspection
  • Other contract services
  • Other inspection equipment and devices

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If it is 5 micrometers or larger, foreign object IR data can be obtained.

  • Contract Analysis
  • Analytical Equipment and Devices
  • Other contract services

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Micro FT-IR imaging measurement

We would like to introduce the "Microscopic FT-IR Imaging Measurement" that we conduct. It allows for the visualization of the distribution of substances as a two-dimensional image within a specified plane. It becomes possible to evaluate changes in the distribution of substances that are difficult to assess with regular point measurements through visual images.

We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.

  • Contract Analysis
  • Analytical Equipment and Devices
  • Other contract services

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Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

TOF-SIMS can analyze light elements and inorganic substances as well as large organic molecules.

  • Analytical Equipment and Devices
  • Contract Analysis
  • Other contract services

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?chemical analysis.png

Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

We provide comprehensive support for customers facing reliability issues with overseas manufactured LCD displays, from reliability testing to failure analysis and material analysis.

  • Contract Inspection
  • Testing Equipment and Devices
  • Contract Analysis

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?Constant temperature and humidity chamber.jpg

In-chamber imaging during constant temperature and humidity testing.

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, allowing us to capture and monitor the operational status, such as screen displays, during the tests. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects with loggers (for voltage, current, resistance, temperature, etc.) is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber with a front glass window option, a camera, and monitoring software to conduct environmental tests while capturing and monitoring the condition of the test equipment.

It has high safety and can be used in various environments! Consistent analysis is possible.

  • Contract Analysis

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Case study of failure analysis of oxide-based all-solid-state batteries

We will introduce a case where a series of analyses from failure location identification to cross-sectional observation was conducted on oxide-based all-solid-state batteries that were destroyed by reliability testing. Thermal analysis revealed a tendency for strong heat generation on the side, and X-ray transmission observation showed a white linear contrast anomaly near the boundary where heat generation was observed in the X-ray transmission image. It is suspected that some abnormality is occurring in the white line area. When cross-sectional SEM observation was performed on the area where the anomaly was visible, layer delamination was observed. It is speculated that the positive (negative) electrode layers expanded and contracted repeatedly due to reliability testing, leading to delamination between the current collector and the electrolyte layer.

The Raman spectrum reflects the functional groups of organic compounds! The curing reaction can be estimated to some extent.

  • Contract Analysis
  • plastic

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?chemical analysis.png

Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Observing the behavior of strain in thermal shock testing! The test materials used are FR-1 and FR-4.

  • Substrate in the test chamber.PNG
  • Contract Analysis

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Strain measurement.png

Strain measurement of power module package resin.

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.

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