List of Analysis Services products

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Other safety and hygiene products

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Introducing a case study of an automotive parts manufacturer! A high-speed camera that visualizes on-site challenges.

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  • Data Logger
  • High Speed Camera
  • Analysis Services

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Introducing a case study of a food manufacturer! A high-speed camera that visualizes on-site challenges.

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  • Data Logger
  • High Speed Camera
  • Analysis Services

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Introducing a case study of a precision chemical manufacturer! A high-speed motion recorder that visualizes on-site challenges.

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  • Data Logger
  • High Speed Camera
  • Analysis Services

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I'm afraid of equipment downtime! I want to perform maintenance and replacements at the right time! Predictive maintenance is recommended for those who feel this way♪

  • Temperature Sensor
  • Other Sensors
  • Analysis Services

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【New Catalog Release】Don't stop the equipment! We have released an introductory catalog on 'Predictive Maintenance from the Basics'.

Discovering abnormalities in production equipment "before it stops" — A new catalog that allows you to learn the concept of predictive maintenance from the basics, titled "Learning Predictive Maintenance from the Ground Up," has been released. This introductory material responds to voices from the manufacturing field, such as "I don't know where to start" and "Implementing IoT is difficult." In this document, we cover: - The benefits of implementing predictive maintenance - What are the specific methods of predictive maintenance? (Comparison of current/vibration/sound/AE/particles in oil/big data) - Four key checkpoints for selection - Recommended lineup for each method Examples of utilizing IoT gateways and remote monitoring systems We have summarized the concepts of equipment maintenance in the DX era in an easy-to-understand manner. ▼ You can download the catalog from here.

We will respond to the rationalization of design development, shortening of periods, performance improvement, and cost reduction.

  • Analysis Services
  • Contract Analysis

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Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!

  • Analysis Services
  • Analytical Equipment and Devices

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Observation of tracking camera cross-section by mechanical grinding.

I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.

Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.

  • Analysis Services
  • Analytical Equipment and Devices

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Observation of thermal deformation using a 3D shape measuring machine (VR-6200)

This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.

By adding a special reagent to the sample and heating it, it becomes possible to detect substances that are usually difficult to detect!

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  • Analysis Services
  • Contract Analysis

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Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

We will suggest appropriate analysis methods based on the condition of polymer materials and samples!

  • Contract Analysis
  • Analysis Services
  • Contract Analysis

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Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Distinguish and identify compounds with similar structures! You can obtain information such as the number of protons and structural characteristics.

  • Contract Analysis
  • Analysis Services
  • Contract Analysis

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NMR analysis of liquid crystal compounds

At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we highlight the 1H NMR, 13C NMR, and DEPT measurements of 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2), which is used as a liquid crystal component, and introduce the information obtained from NMR. Please feel free to download and take a look.

It is possible to analyze resin materials and evaluate the characteristics that affect product performance!

  • Contract Analysis
  • Analysis Services
  • Contract Analysis

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For transparent materials such as glass and ITO! Measurement and evaluation of various transparent resins before and after UV exposure are also possible.

  • Analysis Services
  • Other contract services
  • Contract measurement

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Optical film light transmission characteristics

At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.

Detect and analyze the absorption wavelengths of organic molecular groups (functional groups)!

  • Contract Analysis
  • Contract Analysis
  • Analysis Services

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Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Depending on the panel size, it is possible to analyze using different ICP-AES/MS devices!

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  • Analysis Services

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?chemical analysis.png

Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Distinguish compounds with similar molecular structures through NMR analysis, elucidating the binding positions of side chains and substituents, as well as branching structures!

  • Contract Analysis
  • Analysis Services
  • Contract Analysis

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?chemical analysis.png

Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

We will introduce an analysis example confirming that the welded area has a large distribution of grain crystals.

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  • Analysis Services
  • Contract Analysis

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

It will lead to the determination of development direction and acceleration! We will respond with abundant technology, knowledge, and equipment.

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  • Analysis Services
  • Other contract services

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Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

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  • Analysis Services
  • Other contract services

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About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

It is possible to analyze with good sensitivity using thermal desorption GC-MS analysis! We propose methods tailored to the symptoms of issues and objectives.

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  • Other analyses
  • Contract Analysis
  • Analysis Services

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?chemical analysis.png

Chemical Analysis Concierge Service

We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

  • Analysis Services
  • Other contract services

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temperature profile.png

About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

If any issues arise, detailed analysis will also be provided! A simplified analysis for customers considering the introduction of overseas LCDs.

  • Analysis Services

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Observation of Conductive Particle Shape in COG Implementation

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

  • Analytical Equipment and Devices
  • Analysis Services

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Appearance observation and measurement services

We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional measurements and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-certified IPC specialists on staff. We provide assistance with observations, consultations, and solutions to various observation-related concerns in accordance with international standards.

Easily explain the technical capabilities of Aites by analyzing molecular structures with diagrams and tables!

  • Analysis Services
  • Structural Analysis

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Analysis of trace metal elements in liquid crystals

We will introduce a case where ICP measurement was conducted using panels before and after reliability testing, along with quantification. The liquid crystal molecules in an LCD are oriented within the panel, and the display is controlled by changes in the orientation state of the liquid crystal due to voltage. When ionic substances, such as metal elements, are present inside the panel, the liquid crystal may not drive correctly, leading to display defects. It is known that ionic substances can increase due to contamination during manufacturing or long-term use, making it important to quantify and understand them as part of panel quality. Metal ions can be quantitatively analyzed using ICP analysis, and depending on the differences in pretreatment methods and detection sensitivity, ICP-AES and ICP-MS are used selectively. [Analysis Content] ■ Comparison of metal element content using ICP-AES analysis ■ Comparison of metal element content using ICP-MS analysis For more details, please refer to the related products and catalog below.

We will introduce an example of analysis using EBSD for screws (Cu2Zn).

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.

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  • Analytical Equipment and Devices
  • Analysis Services

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Example of analysis of compounds at the SAC solder and Ni pad interface.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

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  • Other analyses
  • Contract Analysis
  • Analysis Services

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Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

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Announcement of the introduction of Talos F200E

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.

Even with SiC power devices, we can provide consistent support for cross-section preparation of specific areas, observation of diffusion layer shapes, as well as wiring structure and crystal structure...

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Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!

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Observation of Conductive Particle Shape in COG Implementation

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

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  • Semiconductor inspection/test equipment

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TEM_TalosF200E.jpg

Announcement of the introduction of Talos F200E

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.

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