List of Etching Equipment products
- classification：Etching Equipment
46～60 item / All 336 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.
- Sputtering Equipment
- Etching Equipment
Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!
- Sputtering Equipment
- Etching Equipment
Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
- Sputtering Equipment
- Etching Equipment
Evatec officially enters the next-generation packaging market in Japan with CLUSTERLINE 600 - Expanding business development towards the era of Panel-Level Packaging for AI and HPC.
Evatec AG (headquartered in Switzerland) is intensifying the deployment of its large panel-compatible coating platform "CLUSTERLINE 600" in the Japanese market and will fully enter the rapidly growing next-generation packaging market for AI (artificial intelligence) and high-performance computing (HPC). In the global semiconductor ecosystem, the transition to new manufacturing architectures such as large interposers, ultra-high-density RDL (Redistribution Layer), glass core substrates, and panel-level packaging is accelerating. In particular, with the increasing size of AI packages, the shift from traditional 300mm wafer-based manufacturing to 600mm class panel processes is gaining attention as a next-generation manufacturing technology. Evatec positions this change as one of the most important growth opportunities in the semiconductor industry over the next decade. By making the CLUSTERLINE 600 its core product, the company aims to expand its advanced packaging business in the Japanese market and support customers' technology development and mass production in areas such as panel-level packaging, advanced IC substrates, and glass core substrates.
Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.
- Etching Equipment
It is a versatile and compact device that enables etching, ashing, and ion cleaning!
- Etching Equipment
- Ashing device
Demo units available for loan! This is a device that performs a series of cleaning and etching processes, including pure water treatment and drying.
- Etching Equipment
【Demo unit available for loan!】A semi-automatic device that transports wafers from the processing tank to the rinse tank via an arc.
- Etching Equipment
Demo units available for loan! Wafers are loaded and processed in a dedicated barrel.
- Etching Equipment
Demo units available for loan! After pre-processing with a cassette, automatic etching is performed with a dedicated barrel.
- Etching Equipment
Install a 3-axis multi-joint clean robot at the center of the device for wafer transport!
- Etching Equipment
We have a track record of devices such as "XeF2 etching equipment" and "batch-type ashing equipment."
- Etching Equipment
A must-see for those involved in the new development of photomasks! A dry etching device with a compact design that can process photomasks and wafers of various sizes.
- Etching Equipment
Various high-precision pressure sensors necessary for flow control in semiconductor manufacturing equipment. Customization of modules is also possible.
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment