Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.
The "CLUSTERLINE600" is a PVD deposition system specialized for large panels. All platforms share a cluster architecture equipped with cassette-to-cassette processing and fully automated processing. 【Chamber Configuration】 ■ Degassing Chamber ■ Ion Etching ■ Ti Sputtering ■ Cu Sputtering *For more details, please download the PDF (English version) or feel free to contact us.
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**Features of SPM Configuration** - Modular chuck design that enables rapid exchange between 100, 150, or 200mm substrates to achieve production flexibility and maximum uptime. - Up to six single-process modules and up to six auxiliary modules for pre-processing and post-processing steps. - Auxiliary module functions such as wafer alignment, buffering, degassing, cooling, and ID reading. - Direct transport and processing capability for ultra-thin wafers with a thickness of up to 70 microns. *For more details, please download the PDF (English version) or feel free to contact us.*
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For more details, please download the PDF (English version) or feel free to contact us.
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CLUSTERLINE 600
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Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.
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