List of Semiconductor inspection/test equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement of various types of wafers below φ4"

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.

• Other semiconductor manufacturing equipment
• Semiconductor inspection/test equipment

The very popular TME series

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Large-diameter silicon wafer measuring instrument

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Measurement of Si wafer thickness, front and back surface P/N determination.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

We provide advanced specialized technology as an integrated R&D foundry.

• Semiconductor inspection/test equipment
• Analytical Equipment and Devices
• Other contract services

A kit has been developed to modify the current FOUP load port for N2 purge functionality within 8 hours. There have been 3,000 units delivered.

• Other semiconductor manufacturing equipment
• Semiconductor inspection/test equipment